NXP launches an isolated CAN transceiver
March 21, 2013 by John Day
Filed under News, Product News
Integrated galvanic isolation and CAN transceiver package benefits electric and hybrid vehicle market
NXP GloTOP telematics module works with GLONASS
February 19, 2013 by John Day
Filed under News, Product News
NXP Semiconductors N.V. introduced GloTOP 2.5G, the latest addition to the company’s ATOP family of telematics solutions. GloTOP is an automotive telematics module specifically designed to work with the Russian GLONASS satellite navigation system.
NXP and Cisco invest in Cohda Wireless for Car-to-X
January 4, 2013 by John Day
Filed under Company News, Industry News, News
NXP Semiconductors and Cisco have each made an investment in Cohda Wireless to advance intelligent transportation systems (ITS) and car-to-X communications. Cohda Wireless is a leading specialist in wireless communication for automotive safety applications. The respective amounts of the investments were not disclosed.
NXP launches its smallest combo chip for keyless entry
September 27, 2012 by John Day
Filed under News, Product News
Compact package allows freedom for distinctive key fob designs; radio transmitter combats RF jamming
NXP delivers dual Power-SO8 MOSFETs in low inductance copper clip package
September 27, 2012 by John Day
Filed under News, Product News
LFPAK56D provides 77% smaller footprint than equivalent DPAK solution
NXP Semiconductors introduced the LFPAK56D portfolio – dual Power-SO8 MOSFETs for automotive applications such as fuel injection, ABS and stability control.
NXP LED ambient lighting ASSP for LIN networks features node position detection
July 19, 2012 by John Day
Filed under News, Product News
UJA1018 simplifies configuration of interior lighting; reduces manufacturing logistics and costs
NXP lunches dual magnetic sensor for safety-critical car engine throttle applications
July 6, 2012 by John Day
Filed under News, Product News
KMA220 delivers dual sensors in a single package, simplifying assembly process and reducing costs
NXP Trench 6 MOSFETs “significantly exceed” AEC-Q101 requirements
May 22, 2012 by John Day
Filed under News, Product News
NXP Semiconductors N.V. introduced a new family of automotive power MOSFETs based on NXP’s Trench 6 technology, which has been shipping for industrial applications for the past two years. Devices in the new family are said to feature extremely low RDSon, high switching performance, and outstanding quality and reliability.
NXP introduces 60V FlexRay transceivers
March 16, 2012 by John Day
Filed under News, Product News
Supports auto industry move to 48V on-board supply
Increased electrification of vehicle applications drives need for higher voltage supply systems
NXP LIN transceiver targets smaller ECU designs
February 23, 2012 by John Day
Filed under News, Product News













