NXP Semiconductors has significantly reduced its product footprint and improved overall performance of its new car infotainment system by using power noise and reliability sign-off solutions for integrated circuits from ANSYS (NASDAQ: ANSS).
With digital radios becoming a standard feature in automobiles, scalable multi-standard support, improved reception performance and cost savings are driving NXP’s product development. ANSYS engineering simulation tools helped NXP combine six chips into a single system-on-chip, the SAF360x – leading to the decreased costs.
NXP Semiconductors N.V. (NASDAQ: NXPI) announced what it said is the world’s first true one-chip solution for smart car access, combining Passive Keyless Entry (PKE), RF transmitter for remote control and immobiliser in a HVQVN32 package – the NCF29A1.
The ultra-compact device allows new key designs and form factors like PKE chips in smartphones, smartwatches or smartphone cases, supporting complementary car access via mobile devices.
Cohda Wireless launched the MK5, its fifth-generation ‘talking vehicle’ product. The MK5 provides advance warning of potential dangers to vehicle safety by wirelessly gathering data from similarly equipped vehicles and infrastructure.
The MK5 addresses both Vehicle-to-Vehicle (V2V) and Vehicle-to-Infrastructure (V2I) implementations, collectively referred to as V2X. Offering best in class performance, the MK5 is suitable for use in trials, automotive production, aftermarket products and roadside infrastructure. V2X technology is expected in production vehicles from 2016.
Cohda Wireless CEO Paul Gray said the MK5 was available as an onboard, roadside or radio module. “The MK5 is Cohda’s smallest product to date, measuring just 90mm x 130mm for the onboard unit and 30mm x 40mm for the radio module,” he said.
Renesas remained the leader in the automotive semiconductor race in 2013, with the company’s dominance in microcomponents and logic integrated circuits (IC) helping it to hold a half-billion-dollar gap over the second-place competitor.
Japan-based Renesas posted automotive semiconductor revenue of $2.9 billion last year, giving the company a market share of 11 percent, according to IHS Technology (NYSE: IHS). This compares to $2.4 billion in revenue and 9 percent share for the No. 2 contender, Infineon of Germany, allowing Renesas to maintain the leading position it held in 2012.
NXP Semiconductors N.V. announced that Volkswagen has approved NXP Mantis™ CAN transceivers for use in Volkswagen vehicles without a common-mode choke, enabling significant system cost savings in applications.
With increasing functions being introduced into the car, the performance of a modern in-vehicle network becomes increasingly critical to the vehicle’s safe and reliable operation. Electromagnetic emission and immunity against electromagnetic interference are among the critical parameters that must be controlled.
Automotive manufacturers define strict specifications that all transceivers must adhere to before being approved for use in the vehicle. Traditionally, a common-mode choke has been required to reach the performance limits in the application, creating an additional cost of approximately 10-15 cents (USD) per module.
Integrated galvanic isolation and CAN transceiver package benefits electric and hybrid vehicle market
NXP Semiconductors introduced the TJA1052i, a high-speed Controller Area Network (CAN) transceiver with integrated galvanic isolation technology. NXP said the TJA1052i is the first ISO11898-2 compliant product of its kind to offer this level of integration at AEC-Q100 automotive grade quality.
The TJA1052i targets CAN networks where high- and low-voltage networks co-exist – such as in electric and hybrid vehicles – and require galvanic isolation for safety reasons. Adding isolation to the CAN transceiver significantly simplifies the design effort to safely bridge between high and low voltage levels. The TJA1052i provides protection against electric shocks, overvoltage, ground offset and reverse current, while significantly improving signal integrity in noisy electromagnetic environments.
NXP Semiconductors N.V. introduced GloTOP 2.5G, the latest addition to the company’s ATOP family of telematics solutions. GloTOP is an automotive telematics module specifically designed to work with the Russian GLONASS satellite navigation system.
Featuring a parallel reception system for both GLONASS and GPS, GloTOP can automatically select the most optimal signal to ensure the most accurate positioning. It also enables the quick and easy integration of telematics applications in vehicles accessing this satellite system.
NXP Semiconductors and Cisco have each made an investment in Cohda Wireless to advance intelligent transportation systems (ITS) and car-to-X communications. Cohda Wireless is a leading specialist in wireless communication for automotive safety applications. The respective amounts of the investments were not disclosed.
The three companies will apply their collective expertise and technologies to help automotive OEMs, suppliers, enterprises and consumers connect vehicles with ITS infrastructure. They intend to develop a complete, market-ready solution for the automotive and ITS industry, including automotive-qualified IEEE 802.11p products for onboard and roadside units that are ready for C2C (car-to-car) and C2I (car-to-infrastructure) deployments across the globe. The firms also intend to make the “Internet of Everything” a reality for the automotive industry, creating a safer and more enjoyable driving experience while improving traffic flow.
Compact package allows freedom for distinctive key fob designs; radio transmitter combats RF jamming
NXP Semiconductors announced the NCF2960, which the firm claims is the world’s smallest combo chip solution for automotive keyless entry with immobilizer functions. It combines a security transponder, micro RISC kernel and multi-channel radio transmitter in a single package.
The NCF2960 addresses the demand from car OEMs for fashionable and distinctive car key designs. The chip’s package size has been reduced by 44% compared to the previous generation. Available in a 24-pin QFN package, it requires only 4-mm x 4-mm of board space, providing key fob manufacturers with maximum design freedom in selecting form factors and in placement of command buttons.
LFPAK56D provides 77% smaller footprint than equivalent DPAK solution
NXP Semiconductors introduced the LFPAK56D portfolio – dual Power-SO8 MOSFETs for automotive applications such as fuel injection, ABS and stability control.
The NXP LFPAK56D range is AEC-Q101 qualified and has a 77-percent smaller footprint than the equivalent DPAK solution, which typically requires two devices. The LFPAK56D range is in volume production and is available immediately.