Renesas remained the leader in the automotive semiconductor race in 2013, with the company’s dominance in microcomponents and logic integrated circuits (IC) helping it to hold a half-billion-dollar gap over the second-place competitor.
Japan-based Renesas posted automotive semiconductor revenue of $2.9 billion last year, giving the company a market share of 11 percent, according to IHS Technology (NYSE: IHS). This compares to $2.4 billion in revenue and 9 percent share for the No. 2 contender, Infineon of Germany, allowing Renesas to maintain the leading position it held in 2012.
NXP Semiconductors N.V. announced that Volkswagen has approved NXP Mantis™ CAN transceivers for use in Volkswagen vehicles without a common-mode choke, enabling significant system cost savings in applications.
With increasing functions being introduced into the car, the performance of a modern in-vehicle network becomes increasingly critical to the vehicle’s safe and reliable operation. Electromagnetic emission and immunity against electromagnetic interference are among the critical parameters that must be controlled.
Automotive manufacturers define strict specifications that all transceivers must adhere to before being approved for use in the vehicle. Traditionally, a common-mode choke has been required to reach the performance limits in the application, creating an additional cost of approximately 10-15 cents (USD) per module.
Integrated galvanic isolation and CAN transceiver package benefits electric and hybrid vehicle market
NXP Semiconductors introduced the TJA1052i, a high-speed Controller Area Network (CAN) transceiver with integrated galvanic isolation technology. NXP said the TJA1052i is the first ISO11898-2 compliant product of its kind to offer this level of integration at AEC-Q100 automotive grade quality.
The TJA1052i targets CAN networks where high- and low-voltage networks co-exist – such as in electric and hybrid vehicles – and require galvanic isolation for safety reasons. Adding isolation to the CAN transceiver significantly simplifies the design effort to safely bridge between high and low voltage levels. The TJA1052i provides protection against electric shocks, overvoltage, ground offset and reverse current, while significantly improving signal integrity in noisy electromagnetic environments.
NXP Semiconductors N.V. introduced GloTOP 2.5G, the latest addition to the company’s ATOP family of telematics solutions. GloTOP is an automotive telematics module specifically designed to work with the Russian GLONASS satellite navigation system.
Featuring a parallel reception system for both GLONASS and GPS, GloTOP can automatically select the most optimal signal to ensure the most accurate positioning. It also enables the quick and easy integration of telematics applications in vehicles accessing this satellite system.
NXP Semiconductors and Cisco have each made an investment in Cohda Wireless to advance intelligent transportation systems (ITS) and car-to-X communications. Cohda Wireless is a leading specialist in wireless communication for automotive safety applications. The respective amounts of the investments were not disclosed.
The three companies will apply their collective expertise and technologies to help automotive OEMs, suppliers, enterprises and consumers connect vehicles with ITS infrastructure. They intend to develop a complete, market-ready solution for the automotive and ITS industry, including automotive-qualified IEEE 802.11p products for onboard and roadside units that are ready for C2C (car-to-car) and C2I (car-to-infrastructure) deployments across the globe. The firms also intend to make the “Internet of Everything” a reality for the automotive industry, creating a safer and more enjoyable driving experience while improving traffic flow.
Compact package allows freedom for distinctive key fob designs; radio transmitter combats RF jamming
NXP Semiconductors announced the NCF2960, which the firm claims is the world’s smallest combo chip solution for automotive keyless entry with immobilizer functions. It combines a security transponder, micro RISC kernel and multi-channel radio transmitter in a single package.
The NCF2960 addresses the demand from car OEMs for fashionable and distinctive car key designs. The chip’s package size has been reduced by 44% compared to the previous generation. Available in a 24-pin QFN package, it requires only 4-mm x 4-mm of board space, providing key fob manufacturers with maximum design freedom in selecting form factors and in placement of command buttons.
LFPAK56D provides 77% smaller footprint than equivalent DPAK solution
NXP Semiconductors introduced the LFPAK56D portfolio – dual Power-SO8 MOSFETs for automotive applications such as fuel injection, ABS and stability control.
The NXP LFPAK56D range is AEC-Q101 qualified and has a 77-percent smaller footprint than the equivalent DPAK solution, which typically requires two devices. The LFPAK56D range is in volume production and is available immediately.
UJA1018 simplifies configuration of interior lighting; reduces manufacturing logistics and costs
NXP Semiconductors N.V has introduced the UJA1018, which it said is the first ASSP (Application Specific Standard Product) for ambient lighting with Node Position Detection. Toni Versluijs, general manager of NXP’s In-Vehicle Networking business, said the technology enables LIN (Local Interconnect Networks) addresses of LED modules to be individually programmed after being installed in the car, rather than during module manufacturing. Benefits for automakers include significant new levels of flexibility and “drastically reduced” manufacturing logistics and costs.
NXP Semiconductors N.V. announced the KMA220, a dual magnetic sensor designed for automotive applications where a mechanical angle needs to be measured. Integrating two sensor systems in a single package, the KMA220 is particularly relevant for throttle control applications where a redundant system solution is required. It operates in a simple disk magnet configuration with no need for a PCB or external components.
NXP Semiconductors N.V. introduced a new family of automotive power MOSFETs based on NXP’s Trench 6 technology, which has been shipping for industrial applications for the past two years. Devices in the new family are said to feature extremely low RDSon, high switching performance, and outstanding quality and reliability.
The parts are fully AEC-Q101 qualified and have successfully completed extended lifetime testing at 175˚C for more than 1,600 hours – significantly exceeding AEC-Q101 requirements and offering extremely low PPM levels.