Freescale Semiconductor announced what it said is the industry’s first general market AEC-Q100 qualified intelligent battery sensor to combine three measurement channels, a 16/32-bit MCU, and a CAN protocol module in a single package.
Freescale Semiconductor introduced the MAC57D5xx, a new family of ARM® Cortex®-based single-chip, triple-core microcontrollers (MCUs) designed for automotive instrument clusters.
With more than 1.7x higher performance than any currently available automotive instrument cluster MCU, the new devices support complex graphics, including heads-up displays that previously required multiple components.
High-end automotive instrument clusters typically incorporate multiple external components, including a main processor, graphics unit, external SRAM, and dedicated circuitry to manage heads-up display warping and other sophisticated functionality. The cost and complexity of integrating these multiple parts previously restricted this functionality to the premium car segment.
Freescale Semiconductor and Broadcom Corporation together launched the Freescale Qorivva MPC5606E, a single-chip microcontroller (MCU) that integrates the Broadcom BroadR-Reach PHY. Its predecessor, the dual-chip MPC5604E, is currently in production. Freescale is sampling the new device now and expects that will be available in production quantities by the end of 2014.
Among other applications the device targets 360-degree “surround view” camera systems, which are used in applications such as park assist and blind spot detection. Automotive OEMS prefer peripheral cameras to be miniaturized and unobtrusive to maintain vehicle aesthetics. Smaller cameras can be more easily hidden within design features of the car, such as a front grill, bumper or wing mirror.
Freescale Semiconductor announced a new series of ARM®Cortex-based Kinetis microcontrollers (MCUs) for automotive body electronics applications.
It said that with new Kinetis EA series MCUs, tier-one suppliers can develop initial prototypes in as little as 24 hours, and potentially reduce research and development time by two weeks or more.
Freescale expects the new Kinetis MCUs to be especially well accepted in China, where time-to-market is paramount and developer familiarity with the ARM architecture is strong. The development environment planned for the Kinetis EA series of MCUs includes comprehensive automotive reference designs and a suite of easy-to-use tools that support fast prototyping for inexperienced and veteran automotive applications engineers alike.
MC33816 for Direct Fuel Injection Engines Improves Fuel Efficiency, Reduces BOM Cost
Freescale Semiconductor announced the MC33816 programmable solenoid controller, a device the company said can reduce emissions and improve fuel efficiency for gasoline and diesel direct fuel injection engines. It can also be used for driving dual clutch transmissions.
4 μCores; 16x Faster Response Time
The MC33816 programmable solenoid controller embeds intelligence with four integrated μCores, enabling four parallel tasks to run independently of the main system microcontroller. The result is a response time up to 16x faster than traditional architectures, thus improving engine efficiency with precise fuel delivery that reduces unnecessary fuel use.
Electromagnetic compatibility (EMC) and electrostatic discharge (ESD) are critical requirements in harsh industrial and automotive environments due to the close proximity of a wide range of networked electronic systems and devices.
According to Freescale, its MC33901 and MC34901 chokeless CAN high-speed physical layer transceivers deliver outstanding EMC performance and high ESD robustness without the need for external components, thereby reducing overall system costs.
The devices also offer fail-safe features to assist with system functional safety, as well as exceptionally low quiescent current down to 8 micro amps.
RealVNC said it has formed partnerships with Freescale® Semiconductor and QNX Software Systems Limited. Freescale selected RealVNC as a partner for MirrorLink™ certified in-car connectivity and QNX will work with RealVNC to bring RealVNC’s MirrorLink mobile-to-vehicle connectivity solution to the QNX CAR™ Platform for Infotainment.
VNC Automotive allows safe and secure access and control of a mobile device from a vehicle head unit or infotainment system. It gives drivers access to all of their smartphone content, such as navigation applications, music libraries and Internet radio stations, while on the move. The mobile device can be directly controlled from the infotainment system touch screen, vehicle bezel keys, steering wheel switches and by voice command, ensuring all content can be accessed safely.
Red Bend Software added Fuse™ to its vRapid Mobile® firmware over-the-air (FOTA) product suite.
With the vRapid Mobile Fuse (Firmware Updating for Small Electronics), manufacturers can remotely update embedded devices in resource-constrained environments—such as tiny automotive ECUs—in half the time, providing significant savings in warranty costs and maintenance.
The company also announced support for vRapid Mobile Fuse on the Freescale® Qorivva® MPC560xB/C/D family of 32-bit MCU integrated devices for automotive body electronics applications.
Scalable solution reduces BOM cost and board space
Freescale introduced what it describes as the industry’s most comprehensive system-level solution for radar-based advanced driver assistance systems (ADAS) – the Qorivva MPC577xK microcontroller (MCU) and the MRD2001 77 GHz radar transceiver chipset.
According to the company, with the new MCU and radar transceiver chipset automakers can implement long-range and mid-range frontal radar for adaptive cruise control and autonomous emergency braking (AEB) systems, and also manage blind spot and side-impact detection.
Freescale Semiconductor said its S12 MagniV portfolio of mixed-signal microcontrollers (MCUs) is helping Chinese automakers address technology challenges in their fast-growing market.
Freescale global automotive marketing manager Andy Macleod said the devices enable highly integrated, single-chip solutions with better reliability, easier and faster application development, lower bills of material and lower manufacturing costs.
Depending on application requirements, single-chip S12 MCUs could eliminate the need for three or more devices; perhaps as many as six, according to Macleod. That translates to smaller boards, more streamlined testing and lower manufacturing costs.