Freescale Semiconductor (NYSE: FSL) introduced the FXTH87 tire pressure monitoring system (TPMS) family, which is the smallest integrated package TPMS solution available at an extremely light weight of 0.3 grams.
The FXTH87 family is 50 percent smaller than competing products, helping designers reduce overall bill of materials costs. Freescale’s newest TPMS system-in-package solution provides low power consumption combined with the highest level of functional integration in one package, featuring a dual-axis accelerometer architecture, pressure and temperature sensor, integrated MCU, RF transmitter and low frequency receiver.
Highly integrated modules based on Freescale i.MX 6 series processor deliver automotive connectivity and applications support
As part of a two-year collaboration with ALPS Electric Co. of Japan, Freescale Semiconductor (NYSE:FSL) announced three automotive-grade connectivity modules for next-generation telematics and Advanced Driver Assistance Systems (ADAS).
The solutions include Freescale’s Smart Application Blueprint for Rapid Engineering (SABRE) based on the i.MX 6 series of applications processors for automotive infotainment and connectivity technology from ALPS to enable smarter, more connected vehicles.
Freescale Battery Cell Controller Balances Measurement Accuracy, Scalability and High Speed Communications
Electric and Hybrid Vehicle Technology Expo –Freescale Semiconductor (NYSE: FSL) announced a highly integrated 14-cell lithium-ion battery cell controller for industrial and automotive applications, designed to cost effectively meet the stringent requirements for ASIL-C functional safety.
With fourteen cell balancing transistors, a current sensor with ±0.5% accuracy from milliamps to kiloamps, and 2 Mbps communication transceiver interface integrated into a single 64-pin QFP package, Freescale’s MC33771 battery cell controller and companion MC33664 isolated communications interface deliver robust, reliable performance for 48 V battery systems, enabling economical scalability beyond 1000 volts.
Freescale Introduces Programmable Wireless Charging Solutions for Automotive and Consumer Applications
The new Wireless Power Consortium (WPC) Qi-certified transmit controller ICs and reference designs are fully qualified and available now.
In-Vehicle Wireless Charging
As feature-rich, power-hungry mobile devices rapidly proliferate, the need to charge anywhere grows imperative.
The U.S. Census Bureau estimates the average American’s daily work commute time to be about 50 minutes, and more consumers are bringing their mobile lives into the car expecting the same options as the home for charging and connectivity – thereby fueling demand for in-vehicle wireless charging.
Asian-Focused Business Conference September 11-12, 2014
MEMS Industry Group (MIG), in partnership with Shanghai Institute of Microsystem and Information Technology (SIMIT) and Shanghai Industrial Technology Research (SITRI), will host MEMS Industry Group® Conference Shanghai, a two-day event exploring the global MEMS and sensors supply chain, with particular focus on Internet of Things (IoT) opportunities in Asia.
Freescale Semiconductor is collaborating with Neusoft Corporation and Green Hills Software to establish an Advanced Driver Assistance Systems (ADAS) ecosystem designed to dramatically speed and simplify the creation of next-generation automotive vision applications.
The solution integrates CogniVue Corporation’s APEX Image Cognition Processing (ICP) IP, available from Freescale, with “silicon-aware” software from Neusoft’s ADAS vision applications, and the safety certified INTEGRITY® operating system and MULTI® tool chain from Green Hills Software.
Freescale Semiconductor announced what it said is the industry’s first general market AEC-Q100 qualified intelligent battery sensor to combine three measurement channels, a 16/32-bit MCU, and a CAN protocol module in a single package.
Freescale Semiconductor introduced the MAC57D5xx, a new family of ARM® Cortex®-based single-chip, triple-core microcontrollers (MCUs) designed for automotive instrument clusters.
With more than 1.7x higher performance than any currently available automotive instrument cluster MCU, the new devices support complex graphics, including heads-up displays that previously required multiple components.
High-end automotive instrument clusters typically incorporate multiple external components, including a main processor, graphics unit, external SRAM, and dedicated circuitry to manage heads-up display warping and other sophisticated functionality. The cost and complexity of integrating these multiple parts previously restricted this functionality to the premium car segment.
Freescale Semiconductor and Broadcom Corporation together launched the Freescale Qorivva MPC5606E, a single-chip microcontroller (MCU) that integrates the Broadcom BroadR-Reach PHY. Its predecessor, the dual-chip MPC5604E, is currently in production. Freescale is sampling the new device now and expects that will be available in production quantities by the end of 2014.
Among other applications the device targets 360-degree “surround view” camera systems, which are used in applications such as park assist and blind spot detection. Automotive OEMS prefer peripheral cameras to be miniaturized and unobtrusive to maintain vehicle aesthetics. Smaller cameras can be more easily hidden within design features of the car, such as a front grill, bumper or wing mirror.
Freescale Semiconductor announced a new series of ARM®Cortex-based Kinetis microcontrollers (MCUs) for automotive body electronics applications.
It said that with new Kinetis EA series MCUs, tier-one suppliers can develop initial prototypes in as little as 24 hours, and potentially reduce research and development time by two weeks or more.
Freescale expects the new Kinetis MCUs to be especially well accepted in China, where time-to-market is paramount and developer familiarity with the ARM architecture is strong. The development environment planned for the Kinetis EA series of MCUs includes comprehensive automotive reference designs and a suite of easy-to-use tools that support fast prototyping for inexperienced and veteran automotive applications engineers alike.