Elektrobit (EB) announced EB tresos Safety Operating System (OS) Multi-Core for automotive electronic control units (ECU).
According to the company, it is the first safety operating system in the automotive industry that enables carmakers and suppliers to create AUTOSAR-based multi-core control units conforming to the highest Automotive Safety Integrity Level (ASIL D) according to ISO 26262.
The AUTOSAR development partnership started more than ten years ago with the promise to manage the increasing electrical/electronic complexity in different domains. The objective was to lower the cost of standardized basic software, support safety, maintain ability, and exchangeability while enabling more powerful tool chains to be constructed through standardized interfaces.
Download full article (PDF)
A number of trends require vehicle manufacturers and their suppliers to adopt new approaches to developing embedded software based on highly specialized know-how. RTA Engineering Services addresses these challenges by providing customer-specific, high-quality embedded software development based on ETAS’ many years of experience in successfully delivering production-ready software.
Download full article (PDF)
Ten years of AUTOSAR have demonstrated the potential of standards offering applicability across competitive boundaries. However, as long as the standardization continues to be confined to the specification level, the effort required for integration, configuration, and
testing remains unnecessarily high. Initiated by Bosch, the non-profit association COMASSO e.V. has embarked on the road that will lead to the provision of an industry-wide reference for AUTOSAR Basic Software.
Download full article (PDF)
The online event is hosted by IBM and facilitated by SAE International. For more information or to register, visit http://www.sae.org/events/cevirt/.
Elektrobit’s methodology combines elements of Agile, Scrum, and Lean. “We’ve seen a huge rise in the complexity of automotive electronics software. The complexity can lead to projects being late, or over budget, or deficient in quality,” says Christian Mies, managing assistant, infotainment solutions.
Expanded Automotive Electronics Design Portfolio Has Potential to Reduce Time to Start of Production (SOP)
Mentor Graphics Corporation has acquired XS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms.
XSe has over ten years of direct experience in the automotive electronics design industry across twenty automotive programs that combine hardware and software expertise. It brings a pioneering approach to accelerate system design and verification by providing automotive-grade hardware and software to reduce the time to start of production (SOP).
Adding to its portfolio of SafeTI™ design components, Texas Instruments Incorporated (TI) introduced its latest 32-bit dual-core lockstep Hercules™ RM57Lx and TMS570LCx microcontrollers (MCUs) for functional safety applications.
Unique to the Hercules MCU platform, the two new floating-point devices offer a 50 percent increase in computational performance over any of TI’s current ARM® Cortex™-R MCUs, allowing designers to utilize a single Hercules MCU to replace several discrete MCUs or an FPGA-MCU combination.
Bosch and IBM Announce Collaboration to Create an Engineering Platform for Vehicle Components and Systems
IBM and Robert Bosch GmbH announced a collaboration to create a new, data-driven systems engineering platform to more efficiently and accurately develop intelligent, interconnected automotive products.
Built on open standards and IBM design tools, the continuous engineering software platform can quickly scale to thousands of partners, clients, engineers and technicians. By engaging all relevant stakeholders in the automotive supply chain and elevating the right data from them, the standards-based platform will cornerstone Bosch’s long term vision for cross-industry collaboration to quickly deliver increasingly smarter vehicles.
Freescale Semiconductor introduced the MAC57D5xx, a new family of ARM® Cortex®-based single-chip, triple-core microcontrollers (MCUs) designed for automotive instrument clusters.
With more than 1.7x higher performance than any currently available automotive instrument cluster MCU, the new devices support complex graphics, including heads-up displays that previously required multiple components.
High-end automotive instrument clusters typically incorporate multiple external components, including a main processor, graphics unit, external SRAM, and dedicated circuitry to manage heads-up display warping and other sophisticated functionality. The cost and complexity of integrating these multiple parts previously restricted this functionality to the premium car segment.
Freescale Semiconductor and Broadcom Corporation together launched the Freescale Qorivva MPC5606E, a single-chip microcontroller (MCU) that integrates the Broadcom BroadR-Reach PHY. Its predecessor, the dual-chip MPC5604E, is currently in production. Freescale is sampling the new device now and expects that will be available in production quantities by the end of 2014.
Among other applications the device targets 360-degree “surround view” camera systems, which are used in applications such as park assist and blind spot detection. Automotive OEMS prefer peripheral cameras to be miniaturized and unobtrusive to maintain vehicle aesthetics. Smaller cameras can be more easily hidden within design features of the car, such as a front grill, bumper or wing mirror.