Expanded Automotive Electronics Design Portfolio Has Potential to Reduce Time to Start of Production (SOP)
Mentor Graphics Corporation has acquired XS Embedded GmbH (XSe), a technology leader in the creation of automotive system architectures and hardware reference platforms.
XSe has over ten years of direct experience in the automotive electronics design industry across twenty automotive programs that combine hardware and software expertise. It brings a pioneering approach to accelerate system design and verification by providing automotive-grade hardware and software to reduce the time to start of production (SOP).
Adding to its portfolio of SafeTI™ design components, Texas Instruments Incorporated (TI) introduced its latest 32-bit dual-core lockstep Hercules™ RM57Lx and TMS570LCx microcontrollers (MCUs) for functional safety applications.
Unique to the Hercules MCU platform, the two new floating-point devices offer a 50 percent increase in computational performance over any of TI’s current ARM® Cortex™-R MCUs, allowing designers to utilize a single Hercules MCU to replace several discrete MCUs or an FPGA-MCU combination.
Bosch and IBM Announce Collaboration to Create an Engineering Platform for Vehicle Components and Systems
IBM and Robert Bosch GmbH announced a collaboration to create a new, data-driven systems engineering platform to more efficiently and accurately develop intelligent, interconnected automotive products.
Built on open standards and IBM design tools, the continuous engineering software platform can quickly scale to thousands of partners, clients, engineers and technicians. By engaging all relevant stakeholders in the automotive supply chain and elevating the right data from them, the standards-based platform will cornerstone Bosch’s long term vision for cross-industry collaboration to quickly deliver increasingly smarter vehicles.
Freescale Semiconductor introduced the MAC57D5xx, a new family of ARM® Cortex®-based single-chip, triple-core microcontrollers (MCUs) designed for automotive instrument clusters.
With more than 1.7x higher performance than any currently available automotive instrument cluster MCU, the new devices support complex graphics, including heads-up displays that previously required multiple components.
High-end automotive instrument clusters typically incorporate multiple external components, including a main processor, graphics unit, external SRAM, and dedicated circuitry to manage heads-up display warping and other sophisticated functionality. The cost and complexity of integrating these multiple parts previously restricted this functionality to the premium car segment.
Freescale Semiconductor and Broadcom Corporation together launched the Freescale Qorivva MPC5606E, a single-chip microcontroller (MCU) that integrates the Broadcom BroadR-Reach PHY. Its predecessor, the dual-chip MPC5604E, is currently in production. Freescale is sampling the new device now and expects that will be available in production quantities by the end of 2014.
Among other applications the device targets 360-degree “surround view” camera systems, which are used in applications such as park assist and blind spot detection. Automotive OEMS prefer peripheral cameras to be miniaturized and unobtrusive to maintain vehicle aesthetics. Smaller cameras can be more easily hidden within design features of the car, such as a front grill, bumper or wing mirror.
By Rick Flores, AUTOSAR Spokesperson, Global Lead of Model-based Electrical System and Software Engineering, General Motors, USA
AUTOSAR is a partnership between automotive manufacturers and their suppliers as well as tool and semiconductor vendors.
The AUTOSAR Development Partnership, celebrating its 10th anniversary in 2013, has been developing an open, standardized software architecture for automotive electronic control units (ECUs) and an accompanying Methodology defining common exchange formats and description templates to enable a seamless configuration process.
This article describes the concept of virtual hardware “in-the-loop” (vHIL). The goal of vHIL is to frontload the testing process by enabling software teams to create and run their software tests before the actual ECU hardware is available. Higher quality tests, higher quality software and a more streamlined “in-the-loop” flow is the intended outcome of this solution.
Besides describing how vHIL fits in the general Model-In-the-Loop (MIL) – Software-In-the-Loop (SIL) – Hardware-In-the-Loop (HIL) process, this article describes in some detail how a virtual prototype model created with Synopsys Virtualizer can be integrated with a MathWorks Simulink plant model. This integration is fundamental for enabling a vHIL solution.
Mentor Graphics Corporation has purchased AUTOSAR assets from Mecel AB, including the Mecel Picea AUTOSAR Development Suite. The acquired assets complement the existing automotive software solution from Mentor including the Volcano™ AUTOSAR products, Mentor® Embedded Hypervisor, and Mentor Automotive Technology Platform (ATP), which enables Linux®-based automotive solutions, including GENIVI-compliant infotainment (IVI) solutions. Terms of the acquisition were not disclosed.
Mentor Graphics partnered with Mecel to develop one of the industry’s first complete AUTOSAR 4.x solutions.
Mentor said its automotive software solutions enable a wide range of subsystems, including secure, homogenous and heterogeneous multicore and single-core ECUs.
dSPACE has released Version 3.5 of TargetLink, dSPACE’s production code generator. The new version includes support for Simulink® enum data types, which allow software developers to use descriptive names for parameters, thus improving model readability and maintainability.
For AUTOSAR-compliant development, the new release supports AUTOSAR Version 4.1.1. ECU resources and test efforts can be saved by generating multi-instantiable software components.
TargetLink 3.5 keeps installation files and project-specific extensions clearly separated. This provides increased process safety and transparency and also facilitates work in large, distributed groups.
SymTA/S 3.4 also includes enhanced FlexRay dynamic segment analysis, AUTOSAR XML 4.x import with Ethernet support and other general usability improvements
Symtavision has launched SymTA/S 3.4 with a new timing design and analysis capability for LIN (Local Interconnect Network) plus FlexRay dynamic segment analysis improvements, AUTOSAR XML 4.x import with Ethernet support, improved Gantt loading, individual license check out, and scripting efficiency improvements.
Symtavision also announced version 3.4 of TraceAnalyzer, its solution for visualizing and analyzing timing data both measurements and simulations, which seamlessly integrates with SymTA/S.