Texas Instruments (TI) (NASDAQ: TXN) announced what it said is the first dynamic dual interface NFC transponder with Q100 automotive qualification.
The RF430CL330H-Q1 transponder enables simple secure pairing (SSP) using the Out of Band (OOB) association model for Bluetooth®, Bluetooth Smart and Wi-Fi® between an NFC-enabled smartphone or tablet and an automotive infotainment system.
The device helps developers pair and connect or execute NFC-enabled Wi-Fi Protected Setup (WPS) with one tap to configure specific driver settings when entering the car, eliminating complicated manual procedures.
The imaging and vision DSP core offers up to 13X performance boost, with an average of 5X less energy usage on vision tasks compared to the previous generation IVP-EP imaging and video DSP.
The Tensilica Vision P5 DSP is built for applications requiring ultra-high memory and operation parallelism to support complex vision processing at high resolution and high frame rates. As such, it is ideal for off-loading vision and imaging functions from the main CPU to increase throughput and reduce power.
Micronas announced the extension of its direct-angle Hall-effect sensor family HAL 37xy with its dual-die variant HAR 37xy. It integrates two fully automotive-qualified silicon dies in a single SOIC8 package for high-precision direct-angle and linear position measurements for the most demanding automotive and industrial application
HAR 37xy sensors follow the trend of enabling true redundancy within a small package to support safety-critical automotive applications according to ISO 26262 rules.
Microchip Technology and Micrel (NASDAQ: MCRL) announced that Microchip has signed a definitive agreement to acquire Micrel for $14.00 per share.
The acquisition price represents a total equity value of about $839 million, and a total enterprise value of about $744 million.
“Micrel’s portfolio of Linear and Power Management products, LAN solutions and Timing and Communications products, as well as their strong position in the Industrial, Automotive and Communications markets, complement many of Microchip’s initiatives in these areas,” said Microchip President and CEO Steve Sanghi.
Ironically, more choices are not always good as this can lead to a wavering state. Similarly, selecting between a controller and converter is tough, especially when there are so many choices with which to design your application. However, just like any decision, the selection can be made easier if given a framework upon which to base this choice. Before going into depth with a step-by-step framework, first we need to understand what a converter or a controller means in the world of power electronics.
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Fairchild Accelerates Electric Vehicle Design with Auto Qualified SuperFET II MOSFETs & High Voltage Rectifiers
Fairchild (NASDAQ: FCS) introduced new automotive qualified SuperFET® II MOSFET and High Voltage Rectifier product families, both of which enable cleaner and smarter vehicles overall and are ideal for increasing the power ratings of onboard chargers and DC-to-DC converters used in hybrid, plug-in hybrid and all-electric vehicles.
“A chief goal for plug-in hybrid and electric vehicle manufacturers is keeping on-board battery chargers and DC-DC converters as light and small as possible while increasing power levels,” said Fabio Necco, Director, Hybrid and Electric Vehicle Segment at Fairchild.
IAR Systems has updated its development tools for ARM® with new device support as well as new functionality. Version 7.40 of IAR Embedded Workbench® for ARM introduces support for ARM Cortex®-M7 microcontrollers from STMicroelectronics and Atmel. In addition, the tools now feature parallel build for shorter build times, as well as an integration of IAR Systems’ new tool C-STAT® for powerful static code analysis.
The ARM Cortex-M7 processor is the most recent addition to the ARM Cortex-M family. It is focused on energy efficiency and high performance and is intended for use in a wide variety of applications including automotive.
Enabling Critical and Non-Critical Applications to Run on a Single Hardware Platform.
QNX Software Systems announced the QNX® Hypervisor 1.0, a real-time Type 1 hypervisor for medical devices, industrial automation systems, and automotive applications such as car infotainment systems, advanced driver assistance systems (ADAS), and digital instrument clusters.
By using the QNX Hypervisor, embedded system developers can consolidate multiple operating systems onto a single compute platform or system-on-chip (SoC), thereby reducing the cost, size, weight, and power consumption of their products.
Vishay Intertechnology’s AEC-Q200-Qualified 25 W Thick Film Power Resistor Saves Space, Lowers Costs
For automotive, industrial, and military applications, the Vishay Sfernice DTO25 saves space compared with previous-generation solutions while providing high power dissipation of at least 3 W on the PCB and a wide range of resistance values.
The DTO25 is non-inductive and provides a resistance range from 0.016 Ω to 700 kΩ. Offering a compact 8.2 mm by 7.3 mm footprint with a low 2.8 mm profile, the thick film resistor can support more than 10 times more energy than competing components in the DPAK package — up to 5 kW+ for a 10-5 second pulse and 10 J for a 0.1 second pulse.
Linear Technology announces the LTC7138, a 140V input-capable high efficiency buck converter that delivers up to 400mA of continuous output current.
It operates from an input voltage range of 4V to 140V, making it ideal for a wide range of telecom, industrial, avionic and automotive applications.
The LTC7138 utilizes a programmable hysteretic mode design to optimize efficiency over a broad range of output currents. It utilizes an internal 1.8 Ohm power MOSFET for robust, high efficiency operation.