MCUs can reduce time to market by 30 percent
Infineon Technologies AG introduced a new family of 32-bit multicore microcontrollers (MCUs) that meet requirements for powertrain and safety applications. The multicore architecture of the new AURIX™ family features up to three independent 32-bit TriCore™ processor cores to meet the highest safety standards in the industry while doubling performance compared to currently available best-in-class devices, according to the company.
Applications for the new MCUs include the control of combustion engines, electrical and hybrid vehicles, transmission control units, chassis domains, braking systems, electrical power steering systems, airbags and advanced driver assistance systems.
Wind River is collaborating with Infineon Technologies as part of a multi-year partnership to extend its integrated software tools portfolio by optimizing Wind River Diab Compiler for the TriCore microcontroller architecture of Infineon Technologies, including the latest AUDO MAX and future TriCore families. Wind River has released an update to Wind River Diab Compiler that includes enhancements for TriCore architecture resulting in increased performance and smaller software footprint for TriCore developers.
Infineon TriCore 32-bit microcontrollers provide high performance and real-time capabilities and are widely used for compute-intensive automotive applications such as power train, passive safety systems, engine control, energy management, and chassis control.
Infineon Technologies AG has launched its AUDO MAX family of 32-bit microcontrollers (MCUs) for automotive powertrain and chassis applications. The AUDO MAX family supports design of engine management systems meeting Euro 5 and Euro 6 emission standards for combustion vehicles and enables the electrification of powertrain functions in electrical vehicles.
Key features of the AUDO MAX family are maximum clock frequencies of up to 300MHz, high-speed interfaces like SENT and FlexRay,™ and support for advanced safety engineering by using the PRO-SIL™ features of the devices. Based on the TriCore™ processor architecture and manufactured in 90-nm process technology, the new MCUs are suited for use at temperatures of up to 170°C.