Infineon power electronics packaging sets standard for high-current capability, efficiency

January 30, 2012 by  
Filed under Design, News, Product News

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Infineon Technologies AG has introduced an innovative package technology that provides high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles.

The new TO package is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead). The first available products using the H-PSOF package technology are 40V OptiMOS™ T2 power transistors offering up to 300A current capability and R DS(on) values of 0.76mΩ. Infineon describes those specifications as a new milestone.