Sensors Expo starts with sensor fusion

May 15, 2013  by  


The MEMS Industry Group (MIG) announced its line-up for the 2013 Sensors Expo & Conference June 4-6, 2013, Rosemont, IL. MIG’s conference programming features A symposium on MEMS sensor fusion on June 4 followed by a two-day MEMS conference track on June 5-6 and a MEMS Pavilion with booths from leading companies in the MEMS supply chain.

Pre-conference Symposium: MEMS Sensor Fusion

During the June 4 symposium—“MEMS Sensor Fusion: Faster: Stronger. Smarter” MIG speakers will discuss how sensor fusion—the intelligent combination of data from several sensors for the purpose of improving application or system performance—is moving rapidly into the commercialization phase.

“MEMS sensor fusion offers the leading approach to meeting or exceeding power, performance and cost requirements in heterogeneous embedded systems—including mobile handsets and tablets,” said Karen Lightman, executive director, MEMS Industry Group.

“And with MEMS sensors critical to the Internet of Things, embedded systems designers are increasingly hungry for information on sensor fusion tools and techniques. That is why, in our third consecutive year of playing a significant role at Sensors Expo, we decided to focus our symposium on this exciting topic.”

The MEMS Pre-conference Symposium will feature:

  • Introduction—Karen Lightman, executive director, MEMS Industry Group
  • MEMS Analyst Panel: Sensor Fusion Growth and Trends—Marwan Boustany, senior analyst MEMS + SENSORS, IHS iSuppli; Laurent Robin, market and technology analyst, Yole Développement; Tony Massimini, chief of technology, Semico Research
  • Simplifying Sensor Fusion—Marcellino Gemelli, senior marketing manager, Bosch Sensortec
  • How to Use Always-On Sensors for Context Awareness: Getting More Out of Mobile Devices—Kevin Shaw, CTO, Sensor Platforms
  • Architectures for “Always-On” Motion Sensor Fusion for Mobile Devices—Per Slycke, CTO and  founder, Xsens Technologies BV
  • Piezoelectric MEMS MicroPowerGenerators for Smart Wireless Sensor Networks—Kathleen Vaeth, vice president of engineering, MicroGen Systems
  • How the Micro-Amp Magnetic Gyro Opens up New Possibilities for Mobile Applications—John Chong, director, product engineering, Kionix
  • Android as a Platform for Sensor Fusion Education and Evaluation—Mike Stanley, systems engineer, Freescale Semiconductor
  • Sensor Modeling for MEMS Sensor Fusion—MaryAnn Maher, CEO and founder, SoftMEMS
  • MEMS Sensor Fusion Panel: A Dive into Standardization—David DiPaola, principal, DiPaola Consulting; Ken Foust, sensor technologist, Intel Corp.; Becky Oh, president and CEO, PNI Sensor Corporation; Satwant Singh, MIPI Alliance
  • Thinking Outside the (Mobile) Box: Other Important High-Value Applications for Sensor Fusion—Alissa Fitzgerald, founder and managing member, A.M. Fitzgerald & Associates

MEMS conference track

At the Sensors Expo & Conference on June 5-6, MIG has picked top speakers from the entire MEMS supply chain to present their findings and solutions to critical challenges and opportunities in MEMS commercialization.

“Our partnership with MEMS Industry Group has become critical, especially as MEMS plays an increasingly important role within the greater sensor ecosystem,” said Wendy Loew, group show director for Questex Media Group, LLC, producers of Sensors Expo. “MIG is uniquely able to bring insightful and pragmatic MEMS-centric programming to Sensors Expo & Conference, and this is invaluable to our attendees.”

The MEMS conference track will include:

  • Industrial Motion Sensors 101—Robert Badalian, senior director of business development, Industrial & Automotive Markets, InvenSense
  • Motion Control Technologies: Interface of the Future—Chuck Gritton, CTO, Hillcrest Labs
  • From Sensor Fusion to Data Fusion: Enabling the Dream of Context-Aware Mobile Devices—Tim Kelliher, customer solutions architect; Dave Rothenberg, marketing director; Movea
  • Tools and Process Capabilities for Next Generation MEMS—Mike Rosa, 200mm MEMS global product/marketing manager, Applied Materials
  • Smart Sensor Systems Made Easy!—Pieter Struik, R&D Engineer; Ad Vaassen, R&D Engineer, Synopsys
  • MEMS Applications in Medicine and Healthcare—Jay Esfandyari, product marketing manager, STMicroelectronics
  • Trends in the MEMS Marketplace and Trends in Wafer Bonding—Eric Pabo, business development manager, EV Group
  • Automating Power Control Using MEMS Sensors—Nitzan Gadish, product applications engineer; James Lee, digital design engineer, Analog Devices
  • The Critical Role of Packaging for MEMS Products—Matthew Apanius, director, Desich SMART Center

MEMS Pavilion and MEMS Lounge

MIG will sponsor and share the MEMS Pavilion, an exhibition area showcasing innovations in MEMS products and services. MIG’s booth is located in #309 of the MEMS Pavilion. MIG will also host MEMS Lounge, a casual networking space within the MEMS Pavilion. Sponsored by EV Group (EVG), MEMS Lounge is open to all attendees of Sensors Expo & Conference and is located in #T2 of the MEMS Pavilion. For more information, visit:

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