Sensors Expo & Conference June 6-7 in Rosemont IL
April 18, 2012 by John Day
Sensing topics and technologies including measurement, detection, pressure, position and temperature will be a focus in the educational program and on the Expo Floor at the Sensors Expo & Conference June 6-7 at the Donald E. Stephens Convention Center in Rosemont, IL.
Conference tracks include Novel Approaches to Measurement & Detection, Applied Sensing, and Sensor and System Design. Sessions include:
Spectral Methods to Extract Useful Information at Very Low Signal Noise – Ralph Levy, CTO Quant Engineering
Position Sensing for Harsh Environment, Mobile Applications: Pan-Tilt-Zoom Actuator for Military Vehicles – Arthur Holzknecht, Sales Manager, Renishaw, Inc. and Pragnesh Patel, Senior Engineer, Moog-Quickset
Non-Traditional Measurements with Eddy-Current Sensors – Gregory Speckman, Technical Services/Customer Support Manager, Kaman Precision Products
Snapshot Hyperspectral Imaging – Jim Daly, Program Manager, Bodkin Design & Engineering, LLC
Accurate Liquid Level Measurement and its Effect on General Aviation Safety and Performance – Cody Morrow, Project Engineer Mechanical Systems, Cirrus Aircraft and Scott Philiben, President, CIES Inc.
Capacitive Ceramic Pressure Sensors – Max Jochem Kreutzer, Senior Expert, Endress + Hauser GmbH +Co. KG
Optical Strain Measurement for Model Validation – John Tyson, President, Trilion Quality Systems, Angelo Nichols, President, Dynamic Control
New Long Stroke Vibration Shaker Design using Linear Motor Technology – Patrick Timmons, Calibration Systems Engineer, The Modal Shop and Mark Schiefer, Senior Scientist, The Modal Shop
In addition to sessions focusing on Novel Approaches to Measurement & Detection, Applied Sensing, and Sensor and System Design, the Sensors Conference Program will also feature education sessions on Big Data & Analytics, Energy Harvesting, MEMS, Mobile Sensing, RFID/M2M and Wireless Sensing.
Exhibitors offering measurement, detection, pressure and temperature solutions include American Swiss Products, Dexter Research Center Inc., EM Microelectronic, Libelium, Micronas GmbH, Mike Technology, Nanjing Wotian Technology, Ocean Optics, Omron Electronic Components LLC, Pico Technology, RMT Ltd, ROHM Co. Ltd, Sensirion Inc., STMicroelectronics, Task Micro Electronics Inc, and TDK Group.
For more information, visit www.sensorsexpo.com.