Freescale S12 MagniV mixed-signal MCUs help solve technology challenges in China

May 29, 2013  by  

 

 

Freescale Semiconductor said its S12 MagniV portfolio of mixed-signal microcontrollers (MCUs) is helping Chinese automakers address technology challenges in their fast-growing market.

Freescale global automotive marketing manager Andy Macleod said the devices enable highly integrated, single-chip solutions with better reliability, easier and faster application development, lower bills of material and lower manufacturing costs.

Depending on application requirements, single-chip S12 MCUs could eliminate the need for three or more devices; perhaps as many as six, according to Macleod. That translates to smaller boards, more streamlined testing and lower manufacturing costs.

Eliminate up to 20 pounds

By combining the latest CAN- and LIN-based S12 MagniV devices with the latest Qorivva MCU body control module in a networked system, car OEMs can eliminate up to 20 pounds of copper wiring and board components, reducing vehicle weight and further improving fuel economy.

“The S12 MagniV single-die solution helps us achieve functionality that previously required multiple devices,” affirmed Jin Zhefeng, senior manager of the Shanghai Automotive Industry Corporation (SAIC) Technology Center.

“It also helps us achieve higher reliability while saving board space, reducing the bill of materials and greatly improving compatibility across devices.”

Traditionally, automotive electronic system designs have required multiple components,  some created with a high-voltage process to connect to the battery and power actuator outputs and others created with a low-voltage digital logic process.

The need to accommodate both high- and low-voltage functions poses a challenge, especially when the end application has space limitations.

Integrating an MCU and an analog front end

S12 MagniV MCUs address the challenge by integrating an analog front end and MCU, providing a comprehensive single-chip solution for applications such as anti-pinch window lifts, instrument clusters and brushless DC motors.

 “By incorporating Freescale S12 MagniV mixed-signal MCUs into the development of STEC’s second-generation anti-pinch window lift modules, we were able to save costs, reduce board size and shorten time to market,” said Mo Yongcong, executive director of the Shanghai SIIC Transportation Electric Co., Ltd. (STEC) Research and Development Center.

“The S12 MagniV device exceeds traditional multi-component solutions and enables us to lead the way in this fiercely competitive market.”

Increasing electronic content per-vehicle

Automobile sales in China are booming, with a 13 percent year-over-year gain for April 2013 according to the China Association of Automobile Manufacturers . At the same time, the amount of electronic content per vehicle continues to increase as automakers add features to differentiate themselves in this highly competitive market.

Through several joint technology labs in China, Freescale is helping accelerate the introduction of innovative designs into the automotive market. Freescale and Tongji University in Shanghai developed an anti-pinch window lift reference design, which demonstrates the capabilities of the S12 MagniV portfolio. This reference design is based on the S12 MagniV S12VR MCU and is ideal for the development of power windows and sun roof systems.

In addition to collaborating with Tongji University, Freescale participates in automotive joint labs across China with partners including ChangAn Motor, Chery, Foton Motor, Dongfeng Motor and FAW. Freescale helps advance the Chinese automotive electronics market through these relationships and also by offering a number of technical design seminars across the country aimed at providing the content and insight needed to help attendees increase productivity and inspire new designs.

 

 

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