“The current demographic scenario across the globe consists of a high component of technology-savvy population that is keen to adopt technology in every aspect of life. Such demographics represent an added advantage for the market as their buying criteria depends heavily on technological features, digital capabilities, and low maintenance, in addition to value for money,” says Siddharth Jaiswal, a lead automotive electronics research expert from Technavio.
Featuring shunt calibration, the latest WISER system is designed to simplify instrumentation verification for users, while allowing them to check calibration of the system in the field. In addition, the new WISER system has been enhanced with two additional programmable analog outputs, a higher-speed GUI, and a sturdier enclosure. In booth 1176 in Hall 1 at Messe Stuttgart, TECAT will provide live demonstrations of the new system monitoring strain in flex plates, measuring torque in half shafts, and measuring temperature and vibration to predict failure in U-joints.
LDRA announced an agreement with ULMA Embedded Solutions to provide sales and technical support services to LDRA customers in Spain. Headquartered in Oñati with extensive regional sales and support capabilities, ULMA provides embedded design, development, test, and support services to the same safety-critical markets served by LDRA including automotive.
“ULMA’s deep knowledge of safety-, mission-, and security-critical markets, products, and applications make it an ideal partner to help LDRA meet growing customer demand for its safety-compliance management and certification products and services,” said Ian Hennell, Operations Director at LDRA. “In addition, ULMA’s regional presence and reputation for outstanding service will prove invaluable as LDRA continues to expand its European customer base.”
Synopsys collaborating with automotive industry leaders to improve security testing requirements for software development and supply chain management
Synopsys’ Mike Ahmadi helps form SAE Cybersecurity Assurance Testing Task Force, actively contributes to developing community-driven cybersecurity standards
May 23, 2016 by John Day
Sets benchmark in package size with LFPAK33 MOSFET to power secure connections for automotive OEMs
NXP Semiconductors (NASDAQ: NXPI) announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK).
The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
STMicroelectronics and Autotalks Fuse Satellite Navigation with Vehicle-to-Vehicle and -Infrastructure Communication
Lane-level accuracy in urban canyons, tunnels, and parking structures will enable the development of new applications, such as autonomous on-street and in-garage parking and available-spot identification
STMicroelectronics (NYSE: STM) and Israel-based Autotalks, a V2X-chipset market pioneer and leader in the first wave of V2X deployments, have announced their fusion of GNSS technology and V2X ranging. The new “V2X-Enhanced GNSS” ensures authenticated and secure vehicle localization for extreme accuracy and reliability of positioning information, especially in urban canyons, tunnels, and parking structures, where accurate absolute and relative positioning—to other vehicles and infrastructure—is critical in progress toward semi- and fully-autonomous vehicles.
For high-temperature automotive and industrial applications, the Vishay BCcomponents devices provide low impedance, high ripple current, and long useful life.
146 CTI series capacitors are available in nine case sizes with operating temperatures to +125 °C, while the 160 CLA series is offered in six case sizes and provides high-temperature operation to +150 °C. The AEC-Q200-qualified devices feature low impedance down to 35 mΩ at 100 kHz for better filtering, a high rated ripple current to 1,750 mA, and long useful life to 6,000 h for high reliability.
Mobileye and STMicroelectronics to Develop EyeQ®5 System-on-Chip, Targeting Sensor Fusion Central Computer for Autonomous Vehicles
5th-generation System-on-Chip, scheduled to sample in H1 2018, builds on long-standing cooperation between Mobileye and ST and market success of EyeQ technology, available now or in the near future on vehicles from
25 car manufacturers
Mobileye (NYSE:MBLY) and STMicroelectronics (NYSE:STM) are co-developing the next (5th) generation of Mobileye’s SoC, the EyeQ®5, to act as the central computer performing sensor fusion for Fully Autonomous Driving (FAD) vehicles starting in 2020.
ABI Research finds Tier 1 suppliers are losing their roles as system innovators and developers in the nascent autonomous vehicle market. This is occurring as more OEMs engage directly with software developers and hardware and semiconductor vendors.
“It is becoming increasingly evident that no single Tier 1 supplier can deliver a complete autonomous driving system,” says James Hodgson, Industry Analyst at ABI Research. “As a result, OEMs are increasingly engaging directly with component vendors, and becoming more aligned with product roadmaps from across the value chain. But Tier 1s will not disappear completely and still hold an important role in functional safety, one which requires a more overarching and holistic view than any component vendor can hold.”