Mentor Graphics Capital Harness TVM Speeds accurate wire harness quotes
May 9, 2013 by John Day
Filed under Body Electronics, News, Product News
New software automatically generates detailed harness manufacturing process and cost data specific to each harness design, each factory, and each company’s cost models
Keeps wire harness manufacturers competitive
Mentor Graphics Corp. announced availability of Capital Harness™ TVM, the newest tool in Mentor Graphics’ Capital® software suite.
Infineon Hall sensors offer high precision in small space
May 3, 2013 by John Day
Filed under Body Electronics, News, Product News
TLE496x series in world’s smallest package (SOT23) for Hall Sensors
Infineon Technologies AG has launched Hall sensors aimed at automotive and industrial applications demanding the highest precision, the lowest energy consumption and the smallest space requirements.
Microchip expands LIN portfolio
April 30, 2013 by John Day
Filed under Body Electronics, News, Product News
Adds transceiver, System Basis Chip and System-in-Package devices
Microchip Technology Inc. has expanded its LIN portfolio with the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver; MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN System Basis Chips (SBCs), and PIC16F1829LIN System in Package (SiP).
EM Microelectronic integrated temperature sensor
April 30, 2013 by John Day
Filed under Body Electronics, News, Product News
Suited for automatic vehicle identification
EM Microelectronic, the semiconductor company of the Swatch Group, announced the EM4325V11, a battery-assisted passive (BAP) RFID chip with a calibrated temperature sensor.
TRW launches integrated RKE and TPMS
April 11, 2013 by John Day
Filed under Body Electronics, News, Product News
Less space, weight and wiring complexity; lower cost
TRW Automotive Holdings Corp. has launched its first integrated Remote Keyless Entry (RKE) and Direct Tire Pressure Monitoring system (TPMS) with a major Japanese vehicle manufacturer. The system delivers RKE and TPM functions with fewer parts.
Freescale MCUs help streamline body electronics networks; reduce vehicle weight and board sizes
March 18, 2013 by John Day
Filed under Body Electronics, News, Product News
Qorivva and S12 MagniV devices integrate connectivity, functional safety, security and network management capability, trimming number of required ECUs and associated copper wiring
Delphi introduces plug-and-play connectivity service
January 7, 2013 by John Day
Filed under Body Electronics, News, Product News
At the 2013 Consumer Electronics Show (CES), Delphi announced Vehicle Diagnostics, a cloud-based connectivity service that lets consumers mimic their key fob functions to track, locate, access, secure and monitor their vehicles with a smartphone or browser. The device works in most vehicles sold in the U.S. from 1996 onward. It will be available online and in Verizon Wireless stores. For more, visit connectedcar.delphi.com.
Atmel miniature LIN family has low power consumption
November 15, 2012 by John Day
Filed under Body Electronics, News, Product News
Atmel® announced a new LIN family for automotive switch scan applications and in-vehicle ambient lighting control. The firm said its ATA664151 and ATA664251 include a range of on-chip functions that would otherwise require combining multiple devices.
TI LED driver offers frequency synchronization, PWM dimming, thermal foldback
November 1, 2012 by John Day
Filed under Body Electronics, News, Product News
Texas Instruments Incorporated (TI) introduced a 1.5-A constant current DC/DC buck converter that combines frequency synchronization, pulse-width modulation (PWM) dimming and thermal foldback.
Renesas announces low power MCUs with 40 nm on-chip flash for body applications
September 27, 2012 by John Day
Filed under Body Electronics, News, Product News
Renesas Electronics Corporation announced the RH850/F1x Series of 32-bit microcontrollers (MCUs) as the first products to be released in the RH850 Family of automotive MCUs with on-chip flash memory fabricated on a 40 nanometer (nm) MONOS (metal oxide nitride oxide silicon) process and offering low power consumption. The new MCUs are designed for use in a variety of automotive body applications.








