Molex headers combine USCAR-30 interface with Stac64 connector system

June 4, 2013  by  

 

Molex Incorporated introduces modular, stackable HS Stac™ headers that combine the high-speed USCAR-30 HSAutolink™ interface with the modular, stackable configuration of the Stac64™ connector system. 

With a 0.80mm pitch, the new HS Stac headers are said to offer greater design flexibility and space savings in PCB trace routing for in-vehicle infotainment and telematics devices.

 “Expanding in-vehicle functionality means increasing terminal requirements for devices and modules,” says Laurent Stickeir, global product manager, Molex. 

Mentor Graphics Capital Harness TVM Speeds accurate wire harness quotes

May 9, 2013  by  

 

 

New software automatically generates detailed harness manufacturing process and cost data  specific to each harness design, each factory, and each company’s cost models

Keeps wire harness manufacturers competitive

Mentor Graphics Corp. announced availability of Capital Harness™ TVM, the newest tool in Mentor Graphics’ Capital® software suite.

Capital Harness TVM automatically generates detailed harness manufacturing process and cost data that is specific to each harness design, each factory, and each company’s cost models. It adds rapid, accurate harness manufacturing process modeling and cost calculation capabilities to the Capital “Define-Design-Build-Service” flow.

Infineon Hall sensors offer high precision in small space

May 3, 2013  by  

 

TLE496x series in world’s smallest package (SOT23) for Hall Sensors

Infineon Technologies AG has launched Hall sensors aimed at automotive and industrial applications demanding the highest precision, the lowest energy consumption and the smallest space requirements.

30 percent smaller

The new TLE496x sensors are available in the world’s smallest package (SOT23) for Hall Sensors. At 2.9 x 1.3 x 1.0 mm³ they are approximately 30 percent smaller than the smallest products available today. The TLE496x sensors are based on a new 0,35µm process technology developed by Infineon, and with this new technology Infineon can offer Hall Sensors with various magnetic switching thresholds in an ultra-small package.

Microchip expands LIN portfolio

April 30, 2013  by  

 

Adds transceiver, System Basis Chip and System-in-Package devices

Microchip Technology Inc. has expanded its LIN portfolio with the LIN 2.1 and SAE J2602-2 compliant and low-power MCP2003A transceiver; MCP2021A, MCP2022A, MCP2025 and MCP2050 LIN System Basis Chips (SBCs), and PIC16F1829LIN System in Package (SiP). 

Integration options

The new devices include high integration options such as a voltage regulator, windowed watchdog timer, battery monitor output and an MCU.  They also feature high robustness, including Electromagnetic Compatibility (EMC) and Electrostatic Discharge (ESD) levels of more than 15 kV on the LIN bus and battery-voltage pins, meeting or exceeding automotive manufacturer requirements such as Version 1.3 of the “OEM Hardware Requirements for LIN, CAN and FlexRay Interfaces in Automotive Applications.” 

EM Microelectronic integrated temperature sensor

April 30, 2013  by  

 

Suited for automatic vehicle identification

EM Microelectronic, the semiconductor company of the Swatch Group, announced the EM4325V11, a battery-assisted passive (BAP) RFID chip with a calibrated temperature sensor.

The chip enables accurate remote temperature monitoring using industry standard EPC™ Gen2 wireless protocol. Temperature data logging can be implemented with a companion microcontroller connected to the EM4325V11 via a standard SPI interface.

Automatic vehicle identification

According to the company, BAP technology avoids the pitfalls of both passive and active RFID in automatic vehicle identification (AVI) applications. It is less expensive than active RFID but offers excellent read performance at high speeds and at long range, even in wet conditions. In BAP mode, the EM4325V11 offers -31dBm read sensitivity at chip level, which corresponds to open-field read ranges in excess of 50 meters.

TRW launches integrated RKE and TPMS

April 11, 2013  by  

 

Less space, weight and wiring complexity; lower cost

TRW Automotive Holdings Corp. has launched its first integrated Remote Keyless Entry (RKE) and Direct Tire Pressure Monitoring system (TPMS) with a major Japanese vehicle manufacturer. The system delivers RKE and TPM functions with fewer parts. 

“Integrating RKE and TPMS can offer enhanced value and performance,” said Ken Kaiser, vice president, Global Electronics Engineering. “By eliminating the need for separate receivers for the two systems we can maintain performance characteristics, use less space, reduce system weight and wiring complexity, and ultimately lower material and assembly costs.” 

Freescale MCUs help streamline body electronics networks; reduce vehicle weight and board sizes

March 18, 2013  by  


 

Qorivva and S12 MagniV devices integrate connectivity, functional safety, security and network management capability, trimming number of required ECUs and associated copper wiring

At Electronica China Freescale Semiconductor expanded its Qorivva and S12 MagniV vehicle body network microcontroller (MCU) portfolios with devices that address automotive industry requirements for higher bandwidth networks, improved data security, functional safety implementation and reduced energy consumption.

Freescale said its new Qorivva MPC5748G and S12 MagniV S12ZVL/S12ZVC MCUs bring a new level of integration and function to automotive body applications. The company notes that connectivity needs grow along with the number of electronic control units (ECUs) in a car and it estimates that the average vehicle includes several miles of copper wire weighing 150 pounds or more.

Delphi introduces plug-and-play connectivity service

January 7, 2013  by  

At the 2013 Consumer Electronics Show (CES), Delphi announced Vehicle Diagnostics, a cloud-based connectivity service that lets consumers mimic their key fob functions to track, locate, access, secure and monitor their vehicles with a smartphone or browser. The device works in most vehicles sold in the U.S. from 1996 onward. It will be available online and in Verizon Wireless stores. For more, visit connectedcar.delphi.com.

Atmel miniature LIN family has low power consumption

November 15, 2012  by  

Atmel® announced a new LIN family for automotive switch scan applications and in-vehicle ambient lighting control. The firm said its ATA664151 and ATA664251 include a range of on-chip functions that would otherwise require combining multiple devices.

Available in packages measuring just 5x5mm and 7x7mm, the new LIN devices reduce the end-application footprint as well as the overall cost and development time for automotive ambient lighting applications.

Switch scan applications used in automotive doors, roof modules, and center stacks, benefit from very low sleep mode power consumption, according to Atmel. The current sources are controlled by three independent pulse-width modulation (PWM) signals, which are suited for ambient lighting solutions controlling RGB LEDs.

TI LED driver offers frequency synchronization, PWM dimming, thermal foldback

November 1, 2012  by  

Texas Instruments Incorporated (TI) introduced a 1.5-A constant current DC/DC buck converter that combines frequency synchronization, pulse-width modulation (PWM) dimming and thermal foldback.

The TPS92510 features a 3.5-V to 60-V input voltage operating range and integrated MOSFET. Together with TI’s WEBENCH® LED Architect, the lighting developer can quickly design a power management circuit to drive a string of up to 17 high-brightness LEDs at up to 97-percent power efficiency.

For more information and samples, visit www.ti.com/tps92510-pr.

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