April 24, 2015 by John Day
Wind River® has introduced Automotive Profile for VxWorks, AUTOSAR-compliant software to help customers develop ISO 26262 certifiable automotive safety-critical applications such as advanced driver assist systems (ADAS) to piloted and autonomous driving.
In the age of the Internet of Things (IoT), automotive software and systems are becoming more complex and connectivity is expected to be ubiquitous. As software-driven applications become more prevalent in vehicles, keeping automotive systems secure and tamper-proof is important for vehicle and occupant safety.
Dow Corning EA-7100 Adhesive Expands Automotive Electronics Design Options, Lowers Cost of Ownership
Also Improves Silastic® Fluorosilicone Rubber (FSR)
Dow Corning®, a global leader in silicones and silicon-based technology, introduced Dow Corning® EA-7100 Adhesive, a breakthrough silicone chemistry that greatly expands design options for automotive electronics by enabling strong bonds to a wide variety of substrates.
The one-part, heat-cure adhesive also cures rapidly and at lower temperatures from the “inside out” to greatly accelerate processing, lower energy use, and reduce material costs.
ARM is licensing functional safety support across its Cortex-A, Cortex-R and Cortex-M processor families to deliver even stronger alignment for automotive use as the industry seeks to meet rapidly rising compute demands.
The company said this will help the ARM ecosystem shape next-generation technologies as vehicle manufacturers plan increasingly complex driver assistance and infotainment systems. ARM-based SoCs are already widely used in the automotive sector.
The scalable DSP targets applications requiring merged controller plus DSP computation, ultra-low energy and a small footprint. It can be designed into systems on chips (SoCs) for wearable activity monitoring, indoor navigation, context-aware sensor fusion, secure local wireless connectivity, face trigger, voice trigger and voice recognition.
Optional Instruction Set Architecture (ISA) optimizations are included for wireless protocols including Bluetooth Low Energy, Thread and Zigbee using IEEE 802.15.4, SmartGrid 802.15.4g, Wi-Fi 802.11n and 802.11ah, 2G and LTE Category 0 release 12 and 13, and global navigation satellite systems (GNSS).
April 16, 2015 by John Day
Toshiba Corporation’s (TOKYO:6502) Semiconductor & Storage Products Company launched a 1-channel low-side switch IPD (intelligent power device) that adopts a small-size package for use in automotive applications.
The new product, TPD1058FA, is fabricated with a BiCD process, allowing introduction of a small-size WSON10 package (3mm x 3mm) line-up. This reduces the mounting area by approximately 70% that of Toshiba existing products in a SOP-8 package, contributing to the downsizing of equipment.
• BiCD process（N-channel DMOS output@VDSS=60V）
• Supply voltage: VDD(opr)=4.5 to 5.5V
• Built-in protection and diagnostic functions:
• Protection functions: overcurrent, overtemperature, overvoltage
• Diagnostic functions: overcurrent, overtemperature, open load
• Low Drain-Source ON-resistance:
• RDS(ON)=0.1Ω(max)@VDD=4.5 to 5.5V, Io=2A, Tch=25°C
• Small package: WSON10 (3mm x 3mm)
Twister: STMicroelectronics Simulation Tool to Design Automotive Power Actuators with Solid State Relays in VIPower(TM) M0 Technology
By Romeo Letor, Francesco Giuffre’, and Alessio Brighina
Abstract: TwisterSIM provides mixed electro-thermal and mixed system simulation environment to predict precise behavior of the VIPowerTM M0 Smart Power technology when driving automotive loads. Fast selection of suitable drivers, wiring harness optimization, faulting conditions reproduction, corner parameters assessments are functions that make this tool particularly useful to shorten design time.
Automotive control modules comprise a wide range of solid state relays to be properly selected so as to assess system reliability versus specified loads, mission profile and boundary conditions.
Texas Instruments (TI) (NASDAQ: TXN) introduced the first DLP® chipset engineered and qualified for automotive head-up display (HUD) applications. Combining the award-winning imaging qualities of DLP technology with automotive reliability, the new chipset enables head-up displays with the industry’s widest field of view (FOV) up to 12 degrees. It also enables high brightness, color and contrast levels and provides manufacturers with a scalable platform. For more information, see www.ti.com/headupdisplay.
Linear Technology Corporation announces the LTC3892, a high voltage dual output synchronous step-down DC/DC controller that draws only 29µA when one output is active and 34µA when both outputs are enabled.
The 4.5V to 60V input supply range is designed to protect against high voltage transients, ensuring continuous operation during automotive cold crank and to accommodate a broad range of input sources and battery chemistries.
Each output can be set from 0.8V to 99% of VIN at output currents over 20 amps with efficiencies as high as 96%, making it well suited for 12V or 24V automotive, heavy equipment, industrial control, robotics and telecom applications.
April 7, 2015 by John Day
TE Connectivity (TE) (NYSE: TEL) introduced new wire-to-board headers as part of its Power Triple Lock connector product line; thereby expanding the family of connectors targeting appliances into a growing number of HVAC, automation and control, and automotive designs.
The connectors’ combined attributes of higher-current ratings, connection reliability assurance options and higher temperature operation provide an exceptional value-added solution to customers when compared to similar pin-and-socket connectors.
The 6.0mm center line connectors in the Power Triple Lock connector family offer higher current ratings than competitive products (20A vs.18A). Their higher temperature ratings (150 C vs. 130 C degrees) help increase reliability in cooking and other high-temperature applications.
April 2, 2015 by John Day
Seiko Instruments Inc. announced the S-19611A zero-drift dual op-amp with AEC-Q100 qualification for automotive use, which is optimized for amplification of very small sensor signals.
The S-19611A features very low input offset voltage of 17µV (microvolts) at ambient temperature and offset temperature drift of 0.1µV/°C (microvolts/degree-C) that allow the amplification of sensor signals.
The device targets applications that require highly precise signal amplification without compensating the signals as it enables the higher precision of current sensing and smaller resistance value for sensing current, thereby contributing to the reduction of an ECU’s power consumption.