Sets benchmark in package size with LFPAK33 MOSFET to power secure connections for automotive OEMs
NXP Semiconductors (NASDAQ: NXPI) announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK).
The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
Mentor Graphics introduced a MicReD® 600A that tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD Power Tester 600A allows engineers to test power electronics – such as insulated gate bipolar transistors, IGBTs, MOSFETs, transistors and chargers – for mission-critical thermal reliability and lifecycle performance.
The ever wider adoption of electric and hybrid cars has created a specific need for this solution, since thermal reliability issues can result in EV/HEV recalls.
For high-temperature automotive and industrial applications, the Vishay BCcomponents devices provide low impedance, high ripple current, and long useful life.
146 CTI series capacitors are available in nine case sizes with operating temperatures to +125 °C, while the 160 CLA series is offered in six case sizes and provides high-temperature operation to +150 °C. The AEC-Q200-qualified devices feature low impedance down to 35 mΩ at 100 kHz for better filtering, a high rated ripple current to 1,750 mA, and long useful life to 6,000 h for high reliability.
May 16, 2016 by John Day
Advanced 6-inch wafer capability and process to bring superior SiC offer to carmakers and automotive suppliers
AEC-Q101 qualification program to complete in early 2017, ready for new OEM product launches
STMicroelectronics (NYSE: STM) announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.
May 11, 2016 by John Day
Enable smarter, smaller, and lighter car gateways and body modules
STMicroelectronics (NYSE: STM) has launched a new family of automotive microcontrollers that heralds the advent of more secure and connected cars.
This new family of power-efficient and real-time-capable MCUs brings the world´s first Power Architecture™- based devices manufactured in state-of the-art 40nm Flash technology dedicated to Car Body and Security applications. It is composed of three product lines; SPC58 B-Line, SPC58 C-Line, and SPC58 G-Line, which offer from 512KB to 6MB of embedded Flash memory.
Infineon Power Modules for Hybrid and Electric Vehicles Help Meet Space Constraints; Deliver Higher Power Density
May 10, 2016 by John Day
In order to meet CO 2 regulations worldwide by 2020, a larger number of electric or hybrid vehicles (HEV) is essential. The targets amount to only 95 gram CO 2 per kilometer in Europe, 121 g/km in the US, 117 g/km in China and 105 g/km in Japan. When electrifying existing car platforms, space constraints are a significant challenge. As the inverter has to be placed in the typically cramped engine department, it has to be as small as possible. Inverter size is mainly defined by the power modules employed. Consequently, these have to become smaller while at the same time providing sufficient power to actuate the electric drivetrain. The size of a power module, on the other hand, is defined by the power consumption of the power chips used inside, and the ability to cool these chips to stay below a maximum junction temperature.
u-blox announced the release of its fourth generation firmware for 3D Automotive Dead Reckoning (ADR) GNSS modules and chips. Already suited for first mount or aftermarket road vehicle applications, such as in-car navigation, infotainment systems, telematics units and fleet management, the upgraded GNSS receiver now offers real-time continuous navigation output with an update rate of 20 Hz, enabling low latency for applications such as interactive head-up displays.
As the new firmware includes Galileo, in addition to GPS, GLONASS, BeiDou, QZSS and SBAS, it also supports Galileo-based eCall, the European emergency call system, which will be required in new vehicles starting in 2018.
EnSilica has launched the eSi-ECDSA cryptographic IP designed to help meet the high security communication and latency requirements of automotive Car2Car and Car2Infrastructure (Car2x) applications that form part of today’s emerging Intelligent Transport Systems.
EnSilica’s eSi-ECDSA cryptographic IP is fully compliant with the IEEE 1609.2 and ETSI TS 103 97 standards. These standards define the security layers in the Car2x communication protocols where cryptographic algorithms are the primary tools used to safeguard against information security risks such as message confidentiality, integrity, availability and authenticity.
May 4, 2016 by John Day
150-mA synchronous DC/DC regulators optimize light-load efficiency for factory automation and automotive applications
Texas Instruments (TI) (NASDAQ: TXN) introduced two 65-V, 150-mA synchronous DC/DC buck converters with what the company said is the industry’s lowest 10.5-uA quiescent current (IQ) for powering factory automation and automotive sensor applications requiring high efficiency.
The industrial-grade LM5165 and automotive-grade LM5165-Q1 micro-power step-down regulators feature a wide input voltage (VIN) range and dual control modes for optimizing efficiency and printed circuit board (PCB) area. By using the regulators together with TI’s WEBENCH® Power Design tool, engineers can get their factory and process automation designs to market faster. For more information, samples and an evaluation module, see www.ti.com/lm5165-pr.