NXP Shrinks Power Package for the Connected Car

May 23, 2016  by  

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Sets benchmark in package size with LFPAK33 MOSFET to power secure connections for automotive OEMs

 NXP Semiconductors (NASDAQ: NXPI) announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK).

The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.

Mentor Graphics MicReD® 600A Tests EV/HEV Power Electronics Reliability During Power Cycling

May 23, 2016  by  

Mentor Graphics MicReD Power Tester 600AMentor Graphics introduced a MicReD® 600A that tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD Power Tester 600A allows engineers to test power electronics – such as insulated gate bipolar transistors, IGBTs, MOSFETs, transistors and chargers – for mission-critical thermal reliability and lifecycle performance.

The ever wider adoption of electric and hybrid cars has created a specific need for this solution, since thermal reliability issues can result in EV/HEV recalls.

STMicroelectronics and Autotalks Fuse Satellite Navigation with Vehicle-to-Vehicle and -Infrastructure Communication

May 20, 2016  by  

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Combining GNSS[1] with V2X[2] ranging creates “V2X-Enhanced GNSS”
to ensure security, accuracy, and reliability of positioning information in difficult urban environments

Lane-level accuracy in urban canyons, tunnels, and parking structures will enable the development of new applications, such as autonomous on-street and in-garage parking and available-spot identification

STMicroelectronics (NYSE: STM) and Israel-based Autotalks, a V2X-chipset market pioneer and leader in the first wave of V2X deployments, have announced their fusion of GNSS technology and V2X ranging. The new “V2X-Enhanced GNSS” ensures authenticated and secure vehicle localization for extreme accuracy and reliability of positioning information, especially in urban canyons, tunnels, and parking structures, where accurate absolute and relative positioning—to other vehicles and infrastructure—is critical in progress toward semi- and fully-autonomous vehicles.

Sierra Wireless Launches Fast Vehicle Network for First Responders, Field Services and Transit

May 20, 2016  by  

sierra wireless logoAirLink® MP70 Vehicle Router solves challenge of connecting multiple high-bandwidth in-vehicle applications with LTE Advanced, Gigabit Wi-Fi and Gigabit Ethernet connectivity

Vishay Extends Voltage Range for 146 CTI and 160 CLA Series SMD Aluminum Capacitors

May 20, 2016  by  

vishay 5-20-16 26194799983_6d4d8d5d26_zVishay Intertechnology, Inc. (NYSE: VSH) has extended the voltage range for its Automotive Grade 146 CTI and 160 CLA series of surface-mount aluminum capacitors to 100 V and 80 V, respectively.

For high-temperature automotive and industrial applications, the Vishay BCcomponents devices provide low impedance, high ripple current, and long useful life.

146 CTI series capacitors are available in nine case sizes with operating temperatures to +125 °C, while the 160 CLA series is offered in six case sizes and provides high-temperature operation to +150 °C. The AEC-Q200-qualified devices feature low impedance down to 35 mΩ at 100 kHz for better filtering, a high rated ripple current to 1,750 mA, and long useful life to 6,000 h for high reliability.

Mobileye and STMicroelectronics to Develop EyeQ®5 System-on-Chip, Targeting Sensor Fusion Central Computer for Autonomous Vehicles

May 20, 2016  by  

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5th-generation System-on-Chip, scheduled to sample in H1 2018, builds on long-standing cooperation between Mobileye and ST and market success of EyeQ technology, available now or in the near future on vehicles from
25 car manufacturers

Mobileye (NYSE:MBLY) and STMicroelectronics (NYSE:STM) are co-developing the next (5th) generation of Mobileye’s SoC, the EyeQ®5, to act as the central computer performing sensor fusion for Fully Autonomous Driving (FAD) vehicles starting in 2020.

Autonomous Vehicles Disrupt Tier 1 Supplier Roles

May 20, 2016  by  

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ABI Research finds Tier 1 suppliers are losing their roles as system innovators and developers in the nascent autonomous vehicle market. This is occurring as more OEMs engage directly with software developers and hardware and semiconductor vendors.

“It is becoming increasingly evident that no single Tier 1 supplier can deliver a complete autonomous driving system,” says James Hodgson, Industry Analyst at ABI Research. “As a result, OEMs are increasingly engaging directly with component vendors, and becoming more aligned with product roadmaps from across the value chain. But Tier 1s will not disappear completely and still hold an important role in functional safety, one which requires a more overarching and holistic view than any component vendor can hold.”

Safe Fleet Acquires Rear View Safety

May 18, 2016  by  

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rear view safetySafe Fleet has acquired Rear View Safety (RVS).

Based in Brooklyn NY, Rear View Safety provides back up camera systems and video-based road safety solutions. Rear View Safety has been instrumental in driving the rapid adoption of video systems in commercial fleets including government fleets, recreational vehicles, truck, trailer, commercial van, construction, emergency, bus and shuttle, agriculture and industrial vehicles.

Qualcomm Snapdragon 820A and 602A Processors Support New Google Android Platform

May 18, 2016  by  

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Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., is working with Google on an initiative bringing the power of Android OS embedded directly into the car.

The initiative aims to help car makers create powerful infotainment systems using Android as a common platform, making it easier to add connected services and applications while delivering a safer and more intuitive driving experience. The goal is to accelerate innovation in the car with an approach that offers openness, customization, and scale.

STMicroelectronics Silicon-Carbide Power Devices Accelerate Automotive Electrification

May 16, 2016  by  

stmicro logoComplete set of devices allows full conversion of auto power modules to silicon carbide (SiC) for greater vehicle range, convenience, and reliability

Advanced 6-inch wafer capability and process to bring superior SiC offer to carmakers and automotive suppliers

AEC-Q101 qualification program to complete in early 2017, ready for new OEM product launches

STMicroelectronics (NYSE: STM) announced advanced high-efficiency power semiconductors for Hybrid and Electric Vehicles (EVs) with a timetable for qualification to the automotive quality standard AEC-Q101.

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