IAR Systems has updated its development tools for ARM® with new device support as well as new functionality. Version 7.40 of IAR Embedded Workbench® for ARM introduces support for ARM Cortex®-M7 microcontrollers from STMicroelectronics and Atmel. In addition, the tools now feature parallel build for shorter build times, as well as an integration of IAR Systems’ new tool C-STAT® for powerful static code analysis.
The ARM Cortex-M7 processor is the most recent addition to the ARM Cortex-M family. It is focused on energy efficiency and high performance and is intended for use in a wide variety of applications including automotive.
By Andy Gryc
Co-founder, CX3 Marketing
Conference Director, Connected Car Expo
Tier one companies like Bosch, Continental, Delphi, Denso, Harman, Panasonic, and Visteon have deep expertise in building numerous complex modules for the car companies, they all have the know-how for building reliable, safe systems, and all are willing to be a “secret ingredient” instead of a nameplate brand.
Tomorrow’s car, regardless of who’s building it, will have even more working software in it than today’s cars do. The integration problems that car makers face today will only be compounded in the future with the explosion of smartphone connectivity, apps, wearables, fog computing, big data analytics, ADAS and autonomous technology.
TTTech announced a 50 million euro investment round involving two new strategic partners, General Electric (GE Ventures) and Infineon Technologies AG. The funding is backed by the strong commitment of existing shareholders, led by AUDI AG.
TTTech intends to use the proceeds to accelerate growth with its safety certified solutions in its core markets as well as to enable new value propositions and global support for its customers in the Industrial Internet of Things and autonomous driving car markets.
Cypress Semiconductor Corp. (NASDAQ: CY) has expanded its Traveo™ microcontroller (MCU) family with a new series said to provide automotive manufacturers with a cost-effective platform to deliver 2-D and 3-D graphics and advanced functionality for dashboards, head-up displays and HVAC systems in compact vehicles.
The S6J32BA and S6J32DA series build upon Spansion’s announcement of the Traveo 2-D graphics MCU S6J324C series and the 3-D graphics MCU S6J326C series for midsize cars in October 2014.
Texas Instruments (TI) (NASDAQ: TXN) introduced what it said is the industry’s first smart, high-side power switch with programmable current limit.
As automotive systems become more complex, the various loads within the system can each require different profiles during operation.
Using the TPS1H100-Q1, designers can drive various loads with advanced flexibility in powertrain, body electronics, safety and driver-information systems where reliability is paramount. For more information and to order samples, see www.ti.com/tps1h100-q1-pr.
Alternative voltage monitoring solutions typically call for a low power comparator, a high input voltage LDO to power the comparator and a high value resistive divider to level translate the monitored rail, all of which increase board space and power consumption, and decrease monitoring accuracy.
The LTC2965/LTC2966 avoid the major pitfalls of a discrete solution by integrating all components required to directly interface with high voltage rails in space-efficient 3mm x 3mm packages. Each device includes resistor-programmable threshold inputs to facilitate simple undervoltage, overvoltage or window monitoring of positive or negative rails to within ±1.4% accuracy over temperature.
[NASDAQ: MCHP] — Microchip Technology Inc. announced that the MOST® Cooperation released its MOST150 technology coaxial physical layer specification.
The new industry-standard specification enables Microchip to support smart antenna module connectivity to in-vehicle MOST150 advanced driver assistance system (ADAS) and infotainment networks, via its OS81118AF Intelligent Network Interface Controller (INIC) with integrated coax transceiver.
The MOST150 coaxial physical layer is suited for smart-antenna telematics and other data traffic from AM/FM, DAB, SDARS, DVB-T, 3G/LTE, GPS and Wi-Fi® signals that increasingly need to connect with in-vehicle networks for high-bandwidth control, audio, video and Internet Protocol (IP) communication.
Silicon Labs (NASDAQ: SLAB) introduced a portfolio of receivers/audio processors and multi-standard digital radio ICs designed to deliver best-in-class AM/FM and digital radio performance for the global car radio market.
According to the company, the Si479xx family of AM/FM receivers and digital radio tuners delivers a new benchmark for car radio reception performance with on-chip audio processing at the lowest system cost.
The new Si46xx family, which includes single-chip digital radio coprocessors and data receivers, provides an advanced digital radio audio decoding and data reception solution for analog and digital radio.
Microchip CAN Flexible Data-Rate Transceiver Family Meets and Exceeds Global Automotive Requirements
Cost-competitive MCP2561/2FD Transceivers Withstand Harsh Conditions While Increasing Maximum Data-Rate Capability and Meeting Lower Power Budgets
Microchip Technology Inc. announced a new family of CAN FD (Flexible Data-Rate) transceivers, the MCP2561/2FD.
As an interface between a CAN (Controller Area Network) protocol controller and the physical two-wire CAN bus, these transceivers can serve both the CAN and CAN FD protocols. This product family not only helps automotive and industrial manufacturers with today’s CAN communication needs, but also provides a path for the newer CAN FD networks that are increasingly in demand.
To learn more about Microchip’s CAN transceivers visit http://www.microchip.com/CAN-Transceivers-032315a.
Wind River® has updated its Open Virtualization, Security, and Carrier Grade profiles with the latest Linux kernel, toolchain, and user space from the Yocto Project 1.7 release.
The profiles, add-ons to Wind River Linux, provide developers with key capabilities to create safe, secure, and reliable intelligent systems that will harness the power of the Internet of Things (IoT). The profiles include features that seamlessly integrate with validation tools, documentation, and hardware support.