Infineon Introduces Dual-Sensor Package Devices for Safety Critical Automotive Applications

October 27, 2014  by  

infineon Dual-Sensor-Package-Side-ViewRedundant Sensor Architecture Supports ASIL D Systems and Helps Shrink System Footprint and Reduce Cost

Typically, two sensor chips are needed today for reliable and precise sensing of the steering torque in an electric power steering system. Thanks to a dual-sensor package innovation of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), it will be only one sensor chip in the future.

Infineon today introduced two device families of linear Hall sensors and angle sensors that already use the new dual-sensor package. It supports ASIL D systems and reduces physical space requirements and system cost; for example in steering applications requiring high availability as used in autonomous driving. The dual-sensor package was developed at the Infineon site in Regensburg, Germany.

NI and Alliance Partners Offer Scalable Automotive Functional Test Systems Optimized for Test Throughput

October 27, 2014  by  

NI Automotive Functional Test System

With the growth in electronics in modern-day vehicles continuing to rise and cars becoming increasingly more intelligent, automotive OEMs and suppliers are faced with the challenge of having to innovate quickly and meet short time-to-market demands.

These challenges are made evident on the manufacturing line of the electronic control units (ECUs) when performing functional tests. The continued evolution of ECU functionality combined with the significant volumes of devices being produced is forcing automotive component suppliers to develop a functional testing strategy that will enable them to meet consumer demands most efficiently.

Parallel Functional Tests on Two ECUs

Toshiba Infotainment Companion Chip Supports High-Resolution Multimedia Connectivity, Camera Devices

October 24, 2014  by  

toshiba 10-24-14Toshiba Corporation introduced the TC358791XBG, an automotive companion chip created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

Sample shipments have begun, with mass production scheduled to start in March, 2015.

The TC358791XBG can help reduce both time to market and overall system bill-of-materials costs for automotive infotainment systems.

The new chip supports the latest automotive Gigabit Ethernet AVB standard for applications such as front, rear and surround-view cameras, digital audio, and transferring high-resolution video content to head-unit and rear-seat entertainment systems.

Ford Pre-Collision Assist with Pedestrian Detection to Debut on 2015 Mondeo in Europe

October 23, 2014  by  

Ford Pre-Collision Assist with Pedestrian Detection TechnologyFord is rolling out a new driver-assist system that can reduce the severity of or even eliminate some frontal collisions involving vehicles and pedestrians.

Pre-Collision Assist with Pedestrian Detection uses radar and camera technology to scan the roadway ahead and, if a collision risk with a vehicle or pedestrian is detected, provides a warning to the driver. If the driver does not respond in time, the system can automatically apply up to full braking force to help reduce the severity of or even eliminate some frontal collisions.

New TI SoC, TDA3x, Supports Front, Rear and Surround View ADAS Applications for Entry- to Mid-Level Cars

October 23, 2014  by  

TI 10-23-14At the SAE Convergence conference in Detroit, Texas Instruments (TI) introduced the newest member of its automotive system-on-chip (SoC) family, the TDA3x.

It’s intended to help automakers develop ADAS (Advanced Driver Assistance Systems) applications that meet or exceed NCAP (New Car Assessment Program) requirements, reduce collisions, and enable a more autonomous driving experience in entry- to mid-level vehicles.

ADAS Applications