November 14, 2014 by John Day
I/O Bridging to Multiple Serial Protocols and Advanced Battery Charging Address Developers’ Needs for Lower Power and Flexibility
Microchip Technology Inc., announced the extension of its USB2 Controller Hub (UCH2) portfolio with the new automotive-grade, 4-port USB84604 IC.
Featuring FlexConnect technology and an upstream port that supports both USB2.0 and High Speed Interchip (HSIC) connectivity, the new USB84604 UCH2 is ideal for automotive infotainment system designs, where USB port expansion and connectivity is needed.
November 11, 2014 by John Day
Melexis introduced a fully programmable, extremely compact sensor IC capable of accurately measuring changes in magnetic flux density along its X, Y and Z axes.
Based on the company’s proprietary Triaxis® technology, the MLX90393 provides almost unlimited scope with which all manner of human machine interface implementations can be accomplished – from joystick, slide switches, push/pull switches, levelers, linear swipe switches and rotary knobs through to complex 3D position sensing systems. Suitable for micropower applications, the IC draws just 2.5µA of current when idle. It employs a monolithic pixel cell arrangement and has a 16-bit resolution output.
November 10, 2014 by John Day
Drivers are taught to assess surrounding traffic before changing lanes by checking their rearview and side mirrors and looking over each shoulder.
But even for those who scrupulously follow this sequence of checks, the vehicle’s blind spot – the area alongside and just behind the vehicle – is a constant source of danger and often the cause of serious accidents.
Typically, two sensor chips are needed today for reliable and precise sensing of the steering torque in an electric power steering system. Thanks to a dual-sensor package innovation of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), it will be only one sensor chip in the future.
Infineon today introduced two device families of linear Hall sensors and angle sensors that already use the new dual-sensor package. It supports ASIL D systems and reduces physical space requirements and system cost; for example in steering applications requiring high availability as used in autonomous driving. The dual-sensor package was developed at the Infineon site in Regensburg, Germany.
NI and Alliance Partners Offer Scalable Automotive Functional Test Systems Optimized for Test Throughput
With the growth in electronics in modern-day vehicles continuing to rise and cars becoming increasingly more intelligent, automotive OEMs and suppliers are faced with the challenge of having to innovate quickly and meet short time-to-market demands.
These challenges are made evident on the manufacturing line of the electronic control units (ECUs) when performing functional tests. The continued evolution of ECU functionality combined with the significant volumes of devices being produced is forcing automotive component suppliers to develop a functional testing strategy that will enable them to meet consumer demands most efficiently.
Parallel Functional Tests on Two ECUs