Infineon Introduces Dual-Sensor Package Devices for Safety Critical Automotive Applications

October 27, 2014  by  

infineon Dual-Sensor-Package-Side-ViewRedundant Sensor Architecture Supports ASIL D Systems and Helps Shrink System Footprint and Reduce Cost

Typically, two sensor chips are needed today for reliable and precise sensing of the steering torque in an electric power steering system. Thanks to a dual-sensor package innovation of Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), it will be only one sensor chip in the future.

Infineon today introduced two device families of linear Hall sensors and angle sensors that already use the new dual-sensor package. It supports ASIL D systems and reduces physical space requirements and system cost; for example in steering applications requiring high availability as used in autonomous driving. The dual-sensor package was developed at the Infineon site in Regensburg, Germany.

NI and Alliance Partners Offer Scalable Automotive Functional Test Systems Optimized for Test Throughput

October 27, 2014  by  

NI Automotive Functional Test System

With the growth in electronics in modern-day vehicles continuing to rise and cars becoming increasingly more intelligent, automotive OEMs and suppliers are faced with the challenge of having to innovate quickly and meet short time-to-market demands.

These challenges are made evident on the manufacturing line of the electronic control units (ECUs) when performing functional tests. The continued evolution of ECU functionality combined with the significant volumes of devices being produced is forcing automotive component suppliers to develop a functional testing strategy that will enable them to meet consumer demands most efficiently.

Parallel Functional Tests on Two ECUs

Toshiba Infotainment Companion Chip Supports High-Resolution Multimedia Connectivity, Camera Devices

October 24, 2014  by  

toshiba 10-24-14Toshiba Corporation introduced the TC358791XBG, an automotive companion chip created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

Sample shipments have begun, with mass production scheduled to start in March, 2015.

The TC358791XBG can help reduce both time to market and overall system bill-of-materials costs for automotive infotainment systems.

The new chip supports the latest automotive Gigabit Ethernet AVB standard for applications such as front, rear and surround-view cameras, digital audio, and transferring high-resolution video content to head-unit and rear-seat entertainment systems.

Ford Pre-Collision Assist with Pedestrian Detection to Debut on 2015 Mondeo in Europe

October 23, 2014  by  

Ford Pre-Collision Assist with Pedestrian Detection TechnologyFord is rolling out a new driver-assist system that can reduce the severity of or even eliminate some frontal collisions involving vehicles and pedestrians.

Pre-Collision Assist with Pedestrian Detection uses radar and camera technology to scan the roadway ahead and, if a collision risk with a vehicle or pedestrian is detected, provides a warning to the driver. If the driver does not respond in time, the system can automatically apply up to full braking force to help reduce the severity of or even eliminate some frontal collisions.

New TI SoC, TDA3x, Supports Front, Rear and Surround View ADAS Applications for Entry- to Mid-Level Cars

October 23, 2014  by  

TI 10-23-14At the SAE Convergence conference in Detroit, Texas Instruments (TI) introduced the newest member of its automotive system-on-chip (SoC) family, the TDA3x.

It’s intended to help automakers develop ADAS (Advanced Driver Assistance Systems) applications that meet or exceed NCAP (New Car Assessment Program) requirements, reduce collisions, and enable a more autonomous driving experience in entry- to mid-level vehicles.

ADAS Applications

Designing 2015 Toyota Avalon Electrical Systems

October 20, 2014  by  

toyota engineers

Charan Lota, Earnee Gilling and Nick Sitarski led electrical system design teams for the 2015 Toyota Avalon

Electrical Systems (ES) engineers at the Toyota Technical Center in Saline, Michigan, spent months engaged in customer research in the course of designing the 2015 Toyota Avalon premium midsize sedan that launched this week.

The research included clinics, focus groups, surveys, and visits to dealers.

“A tremendous effort goes into designing a car that meets design goals,” says Avalon chief engineer Randy Stephens. “The (Avalon) powertrain was the same as that in the previous generation, and we had a really competitive powertrain, so what we wanted to do was change everything around it to have this vehicle match our vision.

Kiekert Develops LED Latch for Visible Safety

October 13, 2014  by  

Autoschloss-Hersteller KiekertAutomotive locking systems developer Kiekert AG introduced a LED latch that integrates the door warning lamp directly into the latch versus placing the lamp in the side door paneling.

Compared with conventional solutions, the warning light built into the door latch is visible to road users through the entire opening radius.

The LED latch’s intelligent system architecture saves on packaging space and assembly time and the weight of the side door is reduced. The energy-saving LED lamp also makes an added contribution to improved economy and sustainability.

Application options for the LED latch include a choice of color and brightness, flashing LEDs, child locks and emergency locking.

Dassault Systèmes 3DEXPERIENCE Platform Used on AKKA Link&Go Autonomous Connected Vehicle

October 10, 2014  by  

Akka_Dassault Systemes_LG_PressRelease
AKKA Technologies and Dassault Systèmes have partnered to promote innovation in the self-driving connected vehicle market.

AKKA’s engineers will draw upon the 3DEXPERIENCE platform to develop the next generation of its autonomous Link&Go concept car, using Dassault Systèmes applications to ideate, design, simulate and validate on a single collaborative platform hosted on the Cloud.

The partnership is expected to help speed the development of the next Link&Go concept, the technological advancements of which will focus on how mobility consumers can benefit from customized and customizable services.

Microchip Partners with LDRA for Functional Safety

October 6, 2014  by  

Microchip_Img_1_(300) mod 4NEW

LDRA is partnering with Microchip Technology Inc., enabling customers to meet functional-safety requirements.

Microchip, a leading provider of microcontroller, mixed-signal, analog, and Flash-IP solutions, recommends LDRA tools for applications that must comply with functional-safety standards, including ISO 26262 for road vehicles, IEC 61508 for industrial safety systems, and EN 50128 for rail transportation systems.

Partnership Provides Support for PIC® MCUs and dsPIC® Digital Signal Controllers (DSCs)

The partnership offers seamless integration of the LDRA tool suite with Microchip’s MPLAB® X Integrated Development Environment and MPLAB XC compilers. The LDRA tools focus on compliance while leveraging the MPLAB tools for comprehensive support of Microchip’s line of more than 1000 8-bit, 16-bit and 32-bit microcontrollers and DSCs.

Spansion Expands Traveo™ Family for Automotive with HMI Technologies and Embedded 3D Graphics

October 2, 2014  by  

Spansion_Traveo
Spansion Inc. introduced the latest member of its Spansion® Traveo™ microcontroller family aimed at rich human machine interfaces (HMI) in automotive dashboards.

For the first time, Spansion is integrating its HyperBus™ interface with its ARM® Cortex®-R5-based embedded Traveo MCU, enabling seamless connections with HyperBus memories, including Spansion HyperFlash™ memory, to provide customers design simplification and faster performance in automotive systems.

The latest Traveo family is said to deliver state-of-the-art 2D and 3D graphics optimized to bring sophisticated, automotive-specific graphics functions into the car without increased power and BOM requirements.

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