Bourns New Power Inductor Series Offers DC/DC Conversion Performance for Automotive Applications

December 10, 2014  by  

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New Series of Nine AEC-Q200 Qualified Non-shielded and Shielded Devices
Meet Requirements for Low Profile, Weight, High Current and Low Power

Bourns, Inc. announced the company’s new SMD Power Inductor Series that includes nine new devices designed for automotive applications.

Designated the Bourns® Models SDE0403A, SDE0604A, SDE0805A, SRF0703A, SRF0905A, SRF1280A, SRR0745A, SRR1210A and SRR6040A, the new series consists of non-shielded and shielded construction devices that are AEC-Q200 qualified.

The series features inductance values from 0.47 to 6500 μH, has a heating current range up to 17.9 A and offers profiles as low as 3.2 mm. These features make Bourns® power inductors suitable for a broad array of automotive applications that include driver assistant devices, information/entertainment systems and lighting.

AVX Releases Smallest, Thinnest Fused Undertab High CV Tantalum SMD Chip Capacitors

December 8, 2014  by  

avx 12-8-14 AVV882 F98-AS1 Series High CV Caps PRF98-AS1 Series capacitors feature a 0805 (2012 metric) S case, 0.9mm maximum height, and an internal thin film fuse to protect against short circuits.

AVX Corporation has released a new series of fused high CV tantalum SMD chip capacitors with undertab terminations.

The F98-AS1 Series capacitors feature a proprietary lead-frame-less structure with precise dimensions and low stress packaging, an internal thin film fuse that protects against short circuits, and well-established undertab termination technology that enables high volumetric efficiency and high PCB assembly density.

IR Introduces Automotive-Qualified 600V IGBTs for Air Conditioning Compressors in Hybrid and Electric Vehicles

December 4, 2014  by  

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International Rectifier, IR (NYSE: IRF) introduced the AUIRGP66524D0 and AUIRGF66524D0 automotive-qualified 600V IGBTs optimized for small auxiliary motor drive applications including air conditioning compressors for electric and hybrid vehicles.

Leveraging IR’s COOLiRIGBT™ platform and co-packaged with a soft recovery diode, the 24A AUIRGP66524D0 and AUIRGF66524D0 feature low VCE(ON) to reduce power dissipation and maximum junction temperature of 175°C to achieve extremely high power density.

Available in a standard length lead TO-247 and long lead TO-247 package, the new devices also offer a minimum 6μs short circuit rating at 150°C. A square reverse bias safe operating area (SRBSOA) provides additional ruggedness.

Some Neat Things About the 2015 Subaru Outback

December 3, 2014  by  

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The more I learn about automotive electronics, the more excited I am about what’s coming in cars. I had the opportunity to see a bit of the future that’s available now when I tested the 2015 Subaru Outback, specifically, a 3.6R Limited with a 256-hp, 3.6 liter BOXER six-cylinder engine.

Subaru describes the car as a “segment-defining” midsize crossover that rides on an all-new platform, the features of which include standard Symmetrical All-Wheel Drive, Lineartronic CVT (continuously variable transmission); new standard Active Torque Vectoring, and electric power steering.

Vishay Intertechnology Epoxy-Coated Mini Sensors Offer Fast Temperature Sensing for Automotive Applications

December 1, 2014  by  

vishay 12-01-14 15535860537_a06cef3a92_cVishay Intertechnology, Inc. (NYSE: VSH) introduced a new series of epoxy-coated mini sensors optimized for automotive temperature probes.

Built on advanced NTC thermistor technology, AEC-Q200-qualified NTCLE213E3… sensors deliver fast response times lower than 5 s in air, thanks to a small body diameter of < 2.5 mm. They also offer a rugged design to withstand thermal shocks.

The devices will provide fast and accurate temperature sensing for automotive engine coolant temperature (ECT) and temperature manifold absolute pressure (TMAP) sensors, HVAC systems, and consumer, commercial, and industrial appliances.

Audi MIB-2 Platform Features NVIDIA Tegra 3 SoC

November 21, 2014  by  

audi 11-21-14 CES140058_medium__midAt the 2014 Connected Car Expo (CCE) in Los Angeles, Audi detailed key aspects of the advances in the electronics technology appearing in two of its newest models for 2015.

Audi explained how its MIB-2 (Modular Infotainment Platform) electronics architecture has dramatically shortened the timeline to introduce newer and more powerful processors used for infotainment and driver assistance systems.

MIB-2 debuts in the 2016 A6 and A7 model lines, which made their North American debut at the Los Angeles Auto Show.

Delphi and Ottomatika Partner for Automated Driving

November 21, 2014  by  

delphi 11-21-14 Delphi's_automated_driving_vehicle_DLSV_garage-300dpiDelphi Automotive PLC (NYSE: DLPH) will partner with Ottomatika, Inc., a company started by Carnegie Mellon University, which provides advanced automated driving software, to jointly develop technology that will help accelerate automated driving.

Delphi, the company that first introduced automotive radar systems, will integrate its active safety technologies with Ottomatika’s automated driving software. The combination of the two creates a technology platform that enables a vehicle to make human-like decisions when driving in the city or on the highway.

The platform is flexible and can be expanded and upgraded as the software is updated. It will also support vehicle-to-environment (V2X) communications.

Vector CANape 13.0 Measures and Calibrates ECU Parameters

November 20, 2014  by  

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Vector is introducing the new Version 13.0 of its CANape measurement and calibration tool. The development software for ECU calibration now supports users with such new features as extensive printing and reporting functions as well as statistical evaluations of measurement results.

CANape offers a variety of reporting functions for documenting the results of measurement data analysis and the progress of the calibration project. In the Print View, the different display and calibration windows can be quickly positioned on a page. The windows may be exported as an image file or PDF document by a simple drag & drop operation, and they can be pasted in other tools.

Toshiba Launches New Series of Image Recognition Processors for Automotive Applications

November 18, 2014  by  

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TMPV760 series enables night-time pedestrian detection and 3D reconstruction

Toshiba Corporation (TOKYO: 6502) will expand its line-up of image recognition processors for automotive applications with the launch of the TMPV760 series. Sample shipments of the first device, TMPV7608XBG will start in January 2015, with mass production scheduled for December 2016 onwards.
With “TMPV7608XBG,” Toshiba is supporting the realization of next generation Advanced Driver Assistance Systems (ADAS). Support for standard ADAS features includes AEB (Autonomous Emergency Braking), TSR (Traffic Sign Recognition), LDW (Lane Departure Warning) and LKA (Lane Keeping Assist), HBA (High Beam Assistance), FCW (Forward Collision Warning), plus new applications that include TLR (Traffic Light Recognition) and AEB pedestrian (during both day and night), which will become part of the Euro NCAP testing program in 2018.

“TMPV7608XBG” integrates two new Enhanced CoHOG accelerators[1] that provide far higher accuracy image recognition at night. Connected to multiple, Full HD cameras, the processors analyzes color gradients in supplied images and achieves a night-time detection rate of pedestrians that matches the day-time recognition rate of the company’s current devices[2].

AVX Releases New SMPS Capacitor Simulation Software

November 17, 2014  by  

avx 11-17-14 AVV900 SpiCalci 9.0 Simulation Software PRFeaturing new products, enhanced parts selection & graphing tools, & broader compatibility, SpiCalci 9.0 calculates performance characteristics & parameters for AVX’s advanced multilayer ceramic SMPS capacitors
AVX Corporation has released a new version of its SpiCalci simulation software, an engineering tool that calculates performance characteristics and parameters for its switch mode power supply (SMPS) capacitors.

Featuring enhanced part selection and including nearly all of the new SMPS devices that AVX has introduced over the past two years, many of which are sole-sourced, SpiCalci 9.0 allows engineers to input raw data and generate output information and graphs that will help them choose which of AVX’s advanced multilayer ceramic (MLC) SMPS capacitors will best satisfy their application criteria.

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