“CX-3 was designed to deliver all of the fun and technology of our larger models but at a price in the market where it will be a draw for buyers of all backgrounds. It is truly a vehicle that will help set the pace for its newly emerging segment.” said Jim O’Sullivan, president and CEO, Mazda North American Operations.
Symtavision has launched SymTA/S 3.7, improving timing design and verification for automotive Ethernet and multicore systems. The company also released TraceAnalyzer 3.7 which is fully integrated with SymTA/S 3.7.
SymTA/S 3.7 introduces new Ethernet timing design and verification features including the modeling and analysis of dynamic data chains and data dependent dynamic Ethernet frame packing as well as faster system distribution analysis compared to previous versions.
SymTA/S 3.7 also incorporates new general modeling and timing analysis features – Gantt-Filter, APIs and improved AUTOSAR 4.x multicore import.
Cameras installed in various locations around a vehicle exterior, in combination with cost-effective, powerful and energy-efficient processors, deliver numerous convenience and protection benefits.
By Brian Dipert
Embedded Vision Alliance
Strategic Applications Manager, Automotive Business Unit
Vice President, Product Management and Marketing
Director, Global Automotive Practice
Automotive ADAS Marketing and Business Development Manager
Vice President, Marketing
and Dan Isaacs
Director, Embedded Processing Platform Marketing
The Embedded Vision Summit, May 12 at the Santa Clara Convention Center in Santa Clara, California, sponsored by the Embedded Vision Alliance, is scheduled to include two keynote presentations and six expert talks.
Speakers from Harman International, CogniVue, EyeTech Digital Systems, and Xilinx, will share insights on topics related to automotive vision.
The event is designed for product creators, innovators and business leaders interested in incorporating computer vision into applications including augmented reality and automotive safety. In addition to presentations by industry and technology experts, the Summit will feature a Technology Showcase with vision technology and application demonstrations from 30 companies. Before and after the Summit (on May 11 and May 13), Altera, ARM, BDTI and Synopsys will conduct in-depth workshops.
Freescale Semiconductor (NYSE: FSL), which last fall introduced what it called the “world’s smallest” tire pressure monitoring device for passenger cars (FXTH87), has introduced the wireless FXTH8715 family, combining small size and high pressure accuracy for trucks and other large vehicles. The Freescale TPMS will be included in a module recently introduce by Advanced PressurePro.
The FXTH87 family is 50 percent smaller than competing products, helping designers reduce overall bill of materials costs.
April 27, 2015 by John Day
Supporting the trend from relay to more robust semiconductor solutions, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) rolls out its HITFET™+ family of protected low-side switches.
Infineon said its HITFET+ family (High Integrated Temperature protected MOSFET) offers a compelling feature-set with its diagnosis function, digital status feedback and short-circuit robustness, and – not available until today – controlled slew rate adjustment for easily balancing switching losses and EMC compliance.
Wind River® has introduced Automotive Profile for VxWorks, AUTOSAR-compliant software to help customers develop ISO 26262 certifiable automotive safety-critical applications such as advanced driver assist systems (ADAS) to piloted and autonomous driving.
In the age of the Internet of Things (IoT), automotive software and systems are becoming more complex and connectivity is expected to be ubiquitous. As software-driven applications become more prevalent in vehicles, keeping automotive systems secure and tamper-proof is important for vehicle and occupant safety.
More than 4,000 vehicle owners intent on purchasing a new vehicle within the next 36 months were surveyed, representing four key automotive markets – the U.S., China, Germany and the United Kingdom. While results varied by region, key findings shed light on consumer preferences that manufacturers and apps developers can use to best address market needs as they develop new products for the global marketplace.
Dow Corning EA-7100 Adhesive Expands Automotive Electronics Design Options, Lowers Cost of Ownership
Also Improves Silastic® Fluorosilicone Rubber (FSR)
Dow Corning®, a global leader in silicones and silicon-based technology, introduced Dow Corning® EA-7100 Adhesive, a breakthrough silicone chemistry that greatly expands design options for automotive electronics by enabling strong bonds to a wide variety of substrates.
The one-part, heat-cure adhesive also cures rapidly and at lower temperatures from the “inside out” to greatly accelerate processing, lower energy use, and reduce material costs.
ARM is licensing functional safety support across its Cortex-A, Cortex-R and Cortex-M processor families to deliver even stronger alignment for automotive use as the industry seeks to meet rapidly rising compute demands.
The company said this will help the ARM ecosystem shape next-generation technologies as vehicle manufacturers plan increasingly complex driver assistance and infotainment systems. ARM-based SoCs are already widely used in the automotive sector.