Vishay Intertechnology, Inc. introduced two new matched pairs of AEC-Q101-qualified, high-speed 940 nm infrared (IR) emitters and silicon PIN photodiodes in compact 3 mm by 2 mm side-view surface-mount packages.
Linear Technology Corporation announces the LT8301, a monolithic flyback regulator that significantly simplifies the design of isolated DC/DC converters.
By sampling the isolated output voltage directly from the primary-side flyback waveform, the part requires no opto-isolator or third winding for regulation.
Molex Introduces Vertical Configuration DuraClik™ Connectors for High Vibration Automotive On-Board Instrumentation
Molex Incorporated has released a vertical configuration version of its DuraClik™ 2.00mm pitch wire-to-board connectors. The new vertical DuraClik connector is designed for on-board automotive instrumentation, including steering wheels, shift levers, wiper/blinker levers, headlights, inverters and air conditioners, in addition to electric bicycles, trucks, cranes, factory automation equipment and other high vibration applications.
Cohu, Inc. announced that Elmos Semiconductor AG selected Cohu’s SATURN as its next generation handler platform for automotive IC testing.
CogniVue Corporation announced the first in a series of Advanced Driver Assistance System (ADAS) vision based demonstration applications – Lane Departure Warning (LDW) – for its second generation of APEX™ Image Cognition Processor cores (G2 APEX ICP).
GEO Semiconductor Inc. (GEO), a semiconductor and software company specializing in camera and video solutions, announced the GW3100, GW3200 and GW3210 programmable geometric image processors designed for automotive camera and head-up display applications.
Volvo Car Group (Volvo Cars) and Apple Inc. are joining forces to make Apple’s operating system available to drivers in a new service called Apple CarPlay, which is said to bring all of the features and services familiar to iPad, iPhone or iPod users directly into the car via Volvo Cars’ large center console touch screen display.
The MOST® Cooperation (MOSTCO), the standardization organization for the Media Oriented Systems Transport (MOST) automotive multimedia network technology, welcomes Microchip Technology’s decision last November to make its MOST150 Data Link Layer Specification available for license on a royalty-bearing basis.
Microsemi Corporation announced its new FPGA-based Secure Boot Reference Design for embedded microprocessors.