Maxwell Technologies Partners With Corning to Advance Ultracapacitor Technologies

October 24, 2014  by  

maxwell logoMaxwell Technologies announced a joint development agreement with Corning Incorporated to address challenges frequently cited by ultracapacitor customers, including energy density, lifetime, operating environment, form factor and cost.

Maxwell’s expertise in ultracapacitor cell design, manufacturing processes and capacitive energy storage product designs combined with Corning’s expertise in high-performance materials, analytical capabilities and technology innovations should enable the two parties to ultimately achieve superior product value for customers and end users.

Toshiba Infotainment Companion Chip Supports High-Resolution Multimedia Connectivity, Camera Devices

October 24, 2014  by  

toshiba 10-24-14Toshiba Corporation introduced the TC358791XBG, an automotive companion chip created to drive high-resolution multimedia (audio, video) and camera connectivity for next-generation infotainment applications in the connected car.

Sample shipments have begun, with mass production scheduled to start in March, 2015.

The TC358791XBG can help reduce both time to market and overall system bill-of-materials costs for automotive infotainment systems.

The new chip supports the latest automotive Gigabit Ethernet AVB standard for applications such as front, rear and surround-view cameras, digital audio, and transferring high-resolution video content to head-unit and rear-seat entertainment systems.

New MapleSim Release Makes Design Exploration and Validation Easier

October 23, 2014  by  

MapleSim7CoreImageMaplesoft announced a new release of its system-level modeling and simulation platform, MapleSim™.

The new release, MapleSim 7, makes it substantially easier to explore and validate designs, create and manage libraries of custom components, and use MapleSim models within the engineering toolchain.

Results Manager

Renesas R-Car E2 SoC Targets Entry-Level Cockpits

October 23, 2014  by  

Renesas_10-23-14 R-Car_E2Renesas Electronics said its new R-Car E2 automotive systems on chip (SoCs) and R-Car E2 software development board deliver optimized infotainment and display audio for entry-level integrated cockpit systems that support smartphone interoperability.

Together with other Renesas R-Car Series devices, the new SoC and software can help achieve the scalability required to bridge the full range of integrated cockpit systems from entry-level to high-end models.

Infotainment and Telematics Converging

“There is a shift taking place in the automotive industry, a convergence of infotainment and telematics technologies driven in part by user expectations for similar in-car and out-of-car connected experiences,” said Amrit Vivekanand, vice president of Renesas’ Automotive Marketing Unit.

Ford Pre-Collision Assist with Pedestrian Detection to Debut on 2015 Mondeo in Europe

October 23, 2014  by  

Ford Pre-Collision Assist with Pedestrian Detection TechnologyFord is rolling out a new driver-assist system that can reduce the severity of or even eliminate some frontal collisions involving vehicles and pedestrians.

Pre-Collision Assist with Pedestrian Detection uses radar and camera technology to scan the roadway ahead and, if a collision risk with a vehicle or pedestrian is detected, provides a warning to the driver. If the driver does not respond in time, the system can automatically apply up to full braking force to help reduce the severity of or even eliminate some frontal collisions.

Signal Processing In New TI Jacinto 6 Infotainment Processors Enables Digital Cockpit Integration

October 23, 2014  by  

DRA75x_Block_Diagram_10-16-14

At the SAE Convergence conference, Texas Instruments (TI) added two new Jacinto 6 infotainment processors – Jacinto 6 EP and Jacinto 6 Ex, alternatively designated DRA75x.

The new processors incorporate signal processing functionality allowing automakers to augment infotainment and also pair informational advanced driver assistance systems (ADAS) features. With that combination, automakers can build cars with digital cockpit integration as well as traditional infotainment features without compromising performance.

The new processors were developed on the same architecture as other “Jacinto” devices, so customers can deliver a diverse portfolio of products with hardware and software compatibility, without significant increases in research and development or BOM (bill-of-materials).

New TI SoC, TDA3x, Supports Front, Rear and Surround View ADAS Applications for Entry- to Mid-Level Cars

October 23, 2014  by  

TI 10-23-14At the SAE Convergence conference in Detroit, Texas Instruments (TI) introduced the newest member of its automotive system-on-chip (SoC) family, the TDA3x.

It’s intended to help automakers develop ADAS (Advanced Driver Assistance Systems) applications that meet or exceed NCAP (New Car Assessment Program) requirements, reduce collisions, and enable a more autonomous driving experience in entry- to mid-level vehicles.

ADAS Applications

Digitally Enhanced Power Analog Controllers from Microchip Offer Digital Power Supply Flexibility with Easy Analog Control Loops

October 22, 2014  by  

MCP19118/9 Provide Simple Analog PWM Control and Configurable MCU in Compact Circuit Solution; Industry’s First PMBus™ Compatible Controller with Up to 40V Operation

14967620013_efdc394a44_o

Microchip Technology (NASDAQ: MCHP) announced its latest Digitally Enhanced Power (DEPA) controllers—the MCP19118 and MCP19119 (MCP19118/9).

They provide simple yet effective analog PWM control for DC-DC synchronous buck converters up to 40V, with the configurability of a digital MCU. And they are the industry’s first devices to combine 40V operation and PMBus™ communication interfaces.

Analog Devices Automotive Bus Technology Delivers Superior Digital Audio Quality

October 22, 2014  by  

ADI AD2410 Automotive Audio Bus TransceiverAD2410 transceiver uses new Automotive Audio Bus (A²B) to deliver 50 Mbps bandwidth while reducing audio system cost, weight, and design complexity.

Analog Devices, Inc. (NASDAQ: ADI) introduced a digital audio bus technology capable of distributing audio and control data together with clock and power over a single, unshielded twisted-pair wire.
The AD2410 transceiver is the first in a family of devices that enables ADI’s new Automotive Audio Bus (A²B), which significantly reduces the weight of existing cable harnesses, resulting in improved vehicle fuel efficiency while delivering high fidelity audio. The AD2410 transceiver also eliminates the need for expensive microcontrollers with large memories that are required in existing digital bus architectures.

“As an early implementer of ADI’s A²B, Panasonic Automotive found the technology to significantly reduce cabling complexity and associated cost and weight of next-generation infotainment systems, key areas of focus for Panasonic’s OEM customers”

Melexis Introduces 1.35Mpixel Automotive CMOS Image Sensor for Driver Assistance and Driverless Cars

October 22, 2014  by  

10-22-14 Melexis-PR36_HRES
Combines image quality with ASIL-ready support functions to expedite the emergence of autonomous vehicles

Moonless night conditions down to 0.005 lux (SNR1 illuminance)
• 125dB HDR output without additional ISP chip
• Reduced flicker effect of pulsing LED lights
• Extensive set of self-testing ASIL support functions for emerging safety systems

Melexis introduced its third generation of automotive image sensors – the MLX75421 Blackbird.

This automotive grade, high dynamic range (HDR) image sensor features an extensive set of on-chip functional safety (ASIL) support functions. It has been architected for automotive safety applications like automatic emergency braking (AEB), electronic mirrors/camera monitor systems (CMS) and autonomous evasive steering. The device is also highly optimized for next generation viewing applications like surround/rear view systems with object detection functions.

Next Page »