15+ Million Devices in 100+ Car Models from 25+ Automakers
Texas Instruments (TI) announced that it has shipped more than 15 million advanced driver assistance systems (ADAS) System-on-Chip (SoC) devices to at least 15 tier one suppliers. It estimated that ADAS systems incorporating the SoCs have been deployed in more than 100 car models by more than 25 automakers around the world.
Frost & Sullivan recognized TI with the 2014 Product Leadership Award for ADAS Industry Semiconductor Solutions and gave TI’s TDA2x best-in-class ranking for management vision alignment, process design and technological sophistication, indicating a comprehensive superior solution.
Linear Technology UL60950-Recognized 2kVAC, 2.5W Isolated µModule Converter in 9mm x 15mm x 4.92mm BGA
Linear Technology Corporation introduced the LTM8046, a 2.5W output DC/DC µModule® (micromodule) converter with 2kVAC galvanic isolation (production tested to 3kVDC) in a 9mm x 15mm x 4.92mm ball grid array (BGA) package.
A minimum creepage distance of 4.3mm on the package exterior supports operation at a working voltage up to 400VRMS in a pollution degree 2 environment.*
The isolated transformer, control circuitry, power switches, and a modest amount of input and output capacitance are encased in the BGA package. The UL60950 recognized (file# 464570) LTM8046, combined with three 1206 case size or smaller ceramic capacitors and one 0603 size resistor, comprise a highly compact solution for isolated transportation and other applications.
Tuxera announced that Desay SV Automotive, selected Tuxera FAT and exFAT to power its high-end infotainment system on a Linux platform. Next generation solutions are shipping in Desay’s 2014 and 2015 models.
China’s automotive market shows the fastest growth in the world with a high demand for connected cars with built-in infotainment systems. When it comes to buying a car, digital channels play an increasingly important role. The customers expect more, seeking better interfaces, added services, seamless connectivity and ease of use.
ERM Advanced Telematics, a manufacturer of tracking and telematics solutions, is marketing an analog fuel level reader called eFuel that can transmit refueling and fuel theft events via its StarLink family of tracking devices, using ERM’s proprietary eNet technology.
The eFuel converts the original float sensor data into clear and simple information and offers fuel level changes alerts also during IGNITION OFF/ON thanks to its specially designed pull-up mechanisms. The eFuel offers fast dry calibration, so there is no need to empty the fuel tank. Total calibration takes up to 30 minutes.
Altium Limited announced a new addition to its TASKING C compiler solutions for automotive application development, providing support for the RH850 architecture from Renesas Electronics.
The RH850 is the latest automotive microcontroller family from Renesas to offer high performance balanced with very low power consumption over a wide and scalable range of products. This family provides rich functional safety and embedded security features needed for new and advanced automotive applications. It offers a range of CPU core structures (single, multiple, lock-step and combination thereof) to support high performance and/or high reliability requirements.
Telematics Update will bring together over 250 industry leaders from across the connected car industry, including Ford, Volkswagen, Nissan, and Harman, at the Telematics West Coast 2014 Conference & Exhibition (October 30-31, San Diego) to debate the next era of in-car connected content & services.
With the prediction that there will be over 50 billion connected devices by 2020 (Cisco), connectivity is the word of the moment. Within the automotive sector, the industry focus has moved from simply delivering apps and content into the vehicle towards creating a contextual, personal driving experience that seamlessly fits into this wider connected lifestyle.
CD-adapco announced the completion of its development project targeting the automotive and lithium ion battery industries, enabling faster design and development of advanced electric drive vehicle power systems.
The project, which began in August 2011, is co-funded by the Vehicle Technologies Office in the U.S. Department of Energy (DOE) and managed by DOE’s National Renewable Energy Laboratory (NREL). The project is part of the competitive Computer Aided Engineering of electric drive Batteries (CAEBAT) activity launched by DOE in 2010. The initial award of the project was reported on July 7(th), 2011 and the project team included CD-adapco, Battery Design Inc., Johnson Controls Inc., and A123.
Based on Texas Instrument’s 1 GHz Sitara™AM335x ARM Cortex-A8, the VAR-SOM-AM3_V2 targets automotive applications in addition to those in other industries. Connectivity features in the new version are based on TI’s FCC/CE certified dual band Wi-Fi 802.11 a/b/g/n with optional MIMO and Bluetooth 4.0 / BLE that can achieve effective bit rates of 100 Mbps, together with extended wireless range.
TRW Automotive Holdings Corp. launched its latest-generation Electric Park Brake (EPB) technology with three major Japanese based vehicle manufacturers and will begin production with a fourth automaker in the near future.
The EPB system functions as a conventional hydraulic brake for standard service brake applications, and as an electric brake for parking and emergency braking.
“Because EPB is electronically rather than mechanically controlled it can work with a variety of vehicle systems and sensors,” said Peter Lake, executive vice president, sales for TRW. “As an example, in the U.S. following NHTSA’s recent FMVSS 111 amendment that will require rear backup cameras, an EPB system could be integrated with the video signal and automatically brake the vehicle if a potential issue is detected.”
July 25, 2014 by John Day
XMOS Ltd., the fabless semiconductor company developing intelligent multicore microcontrollers, has completed a $26.2M investment round, adding Robert Bosch Venture Capital GmbH of Germany, Huawei Technologies, and Xilinx Inc. as strategic investors. XMOS will use the new funding to develop multicore technology for embedded applications by expanding customer support and accelerating new product development.
“This funding from major industry players alongside leading technology investors represents a resounding validation for our multicore technology and highlights the growing strength and importance of our business,” said Nigel Toon, CEO at XMOS. “Each of these important new partners will bring major strategic value alongside their significant financial investment in the business. This will help us in our mission to build XMOS into a major fabless semiconductor company.”