XMOS Ltd., the fabless semiconductor company developing intelligent multicore microcontrollers, has completed a $26.2M investment round, adding Robert Bosch Venture Capital GmbH of Germany, Huawei Technologies, and Xilinx Inc. as strategic investors. XMOS will use the new funding to develop multicore technology for embedded applications by expanding customer support and accelerating new product development.
“This funding from major industry players alongside leading technology investors represents a resounding validation for our multicore technology and highlights the growing strength and importance of our business,” said Nigel Toon, CEO at XMOS. “Each of these important new partners will bring major strategic value alongside their significant financial investment in the business. This will help us in our mission to build XMOS into a major fabless semiconductor company.”
At the EV Roadmap 7 Conference in Portland, officials from the U.S. Department of Energy (DOE), Drive Oregon, Intel, Portland General Electric (PGE), the State of Oregon, and other regional businesses announced their participation in DOE’s Workplace Charging Challenge – a collaborative effort to increase the number of U.S. employers providing access to electric vehicle charging stations for employees.
With 76 stations across 11 campuses in the U.S., Intel Corporation is one of the five largest providers of workplace charging in the Energy Department initiative. Marty Sedler, Intel’s Director of Global Utilities and Infrastructure, said, “As a leading technology company, Intel is pleased to help our employees make sustainable transportation choices, and we hope our example will inspire others.”
Flexpoint Sensor Systems, Inc. received notice that an automobile maker has completed testing of a horn switch system incorporating its Bend sensor technology. The system functioned properly and the product can now be designated for incorporation into future vehicle programs.
It is expected that as the horn switch units are integrated into the first available program, the sensor will be expanded to integrate control switches onto the horn pad. Current airbag configurations have limited the design flexibility of horn switches, which are generally placed on the sides of the center steering column to avoid interference with the driver’s side air bag.
The Intelligent Transportation Society of America (ITS America) announced that General Motors CEO Mary Barra will kick off the 21st World Congress on Intelligent Transport Systems (ITS) on Sunday, September 7, in Detroit, Michigan.
Her opening keynote speech will address the changing transportation environment around the world as well as the rapidly evolving technology of connected, autonomous, and electric vehicles.
In what will be the largest transportation technology event of 2014, the ITS World Congress will attract more than 10,000 international business, government, and research leaders to the home of America’s auto industry, Detroit, Michigan, from September 7 – 11, 2014, to showcase the latest transportation innovations and share ideas and strategies for advancing the development and deployment of intelligent transportation solutions to solve the world’s transportation challenges.
Microchip Technology announced its MOST® ToGo Reference Designs, which make it easy for designers to learn and implement the proven MOST technology in their automotive infotainment systems.
MOST ToGo enables designers to leverage Microchip’s extensive experience and focus on their application software development, rather than studying the vast MOST specifications.
Included in both reference designs are three MOST network-compliant hardware nodes with full schematics, code and function catalogs—everything needed to train, learn or develop a full MOST system design, from concept, to implementation to testing.
ZMD AG (ZMDI) announced the ZSSC1750 and ZSSC1751, two automotive-qualified, high-precision data-acquisition system basis chips (SBCs) that extend the firm’s battery sensing and battery management product family.
The ZSSC1750 and ZSSC1751 each include two high-precision, high-resolution analog-to-digital converters (ADCs) for simultaneous measurement of battery voltage and current as well as internal and external temperatures. The chips also provide several power-saving operating modes, including an autonomous periodic wake-up from sleep mode that can run entirely self-contained.
Toshiba America Electronic Components, Inc. (TAEC) announced the TB9052FNG motor pre-driver IC. The new device was developed for safety-critical automotive applications such as electric power steering (EPS) and other systems compliant with Automotive Safety Integrity Level D (ASIL D), the most rigorous measure defined within functional safety standard ISO 26262.
“As electrical systems within vehicles become increasingly sophisticated, there is a concurrent need for components that support and enable the most advanced safety features,” said Deepak Mithani, senior director, Mixed Signal Business Unit at TAEC.
Neonode Inc., a developer of optical touch technology, is collaborating with Magneti Marelli to develop automotive Human Machine Interfaces for next-generation in-car infotainment and telematics systems with particular focus on intuitive ease-of-use, high performance, and safety. Neonode says its optical touch and proximity sensing solutions facilitate performance and reliability, amidst extreme automotive electronics environments.
July 22, 2014 by John Day
Agero, Inc. plans to expand its roadside assistance work force by 30 percent this year across its four regional sites in Clarksville, Tennessee; Sault Ste. Marie, Ontario, Canada; Sebring, Florida, and Tucson, Arizona.
With the help of more than 30,000 roadside assistance providers Agero protects more than 75 million drivers a year in North America during in-vehicle and post-emergency safety and security situations.
Agero CEO Dave Ferrick says the hiring initiative is in response to growing customer demand and to support new capabilities in Agero’s “high-touch” roadside assistance services.
July 21, 2014 by John Day
With displacements between 3.5 and 5.5 liters and power ratings ranging from 249 to 549 HP (185 kW – 410 kW), these powerful engines are available in the Mercedes-Benz C-, E- and S-Classes.
Specially designed for gasoline direct-injection (GDI) engines running stratified combustion, BorgWarner’s compact multi-spark ignition coil technology enlarges the ignition zone for more controlled and optimized combustion, improved fuel economy and reduced emissions.