Sets benchmark in package size with LFPAK33 MOSFET to power secure connections for automotive OEMs
NXP Semiconductors (NASDAQ: NXPI) announced the availability of its new line of automotive power MOSFETs housed in a compact, thermally enhanced Loss Free PAcKage (LFPAK).
The LFPAK33 is optimized for high-density automotive applications with a footprint more than 80 percent smaller than the most popular solution in use today. The significantly smaller low-resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.
Mentor Graphics introduced a MicReD® 600A that tests electric and hybrid vehicle (EV/HEV) power electronics reliability during power cycling. The MicReD Power Tester 600A allows engineers to test power electronics – such as insulated gate bipolar transistors, IGBTs, MOSFETs, transistors and chargers – for mission-critical thermal reliability and lifecycle performance.
The ever wider adoption of electric and hybrid cars has created a specific need for this solution, since thermal reliability issues can result in EV/HEV recalls.
STMicroelectronics and Autotalks Fuse Satellite Navigation with Vehicle-to-Vehicle and -Infrastructure Communication
Lane-level accuracy in urban canyons, tunnels, and parking structures will enable the development of new applications, such as autonomous on-street and in-garage parking and available-spot identification
STMicroelectronics (NYSE: STM) and Israel-based Autotalks, a V2X-chipset market pioneer and leader in the first wave of V2X deployments, have announced their fusion of GNSS technology and V2X ranging. The new “V2X-Enhanced GNSS” ensures authenticated and secure vehicle localization for extreme accuracy and reliability of positioning information, especially in urban canyons, tunnels, and parking structures, where accurate absolute and relative positioning—to other vehicles and infrastructure—is critical in progress toward semi- and fully-autonomous vehicles.
For high-temperature automotive and industrial applications, the Vishay BCcomponents devices provide low impedance, high ripple current, and long useful life.
146 CTI series capacitors are available in nine case sizes with operating temperatures to +125 °C, while the 160 CLA series is offered in six case sizes and provides high-temperature operation to +150 °C. The AEC-Q200-qualified devices feature low impedance down to 35 mΩ at 100 kHz for better filtering, a high rated ripple current to 1,750 mA, and long useful life to 6,000 h for high reliability.
Mobileye and STMicroelectronics to Develop EyeQ®5 System-on-Chip, Targeting Sensor Fusion Central Computer for Autonomous Vehicles
5th-generation System-on-Chip, scheduled to sample in H1 2018, builds on long-standing cooperation between Mobileye and ST and market success of EyeQ technology, available now or in the near future on vehicles from
25 car manufacturers
Mobileye (NYSE:MBLY) and STMicroelectronics (NYSE:STM) are co-developing the next (5th) generation of Mobileye’s SoC, the EyeQ®5, to act as the central computer performing sensor fusion for Fully Autonomous Driving (FAD) vehicles starting in 2020.
ABI Research finds Tier 1 suppliers are losing their roles as system innovators and developers in the nascent autonomous vehicle market. This is occurring as more OEMs engage directly with software developers and hardware and semiconductor vendors.
“It is becoming increasingly evident that no single Tier 1 supplier can deliver a complete autonomous driving system,” says James Hodgson, Industry Analyst at ABI Research. “As a result, OEMs are increasingly engaging directly with component vendors, and becoming more aligned with product roadmaps from across the value chain. But Tier 1s will not disappear completely and still hold an important role in functional safety, one which requires a more overarching and holistic view than any component vendor can hold.”
May 19, 2016 by John Day
Linear Technology Corporation announced the LT8304, a monolithic flyback regulator that simplifies the design of isolated DC/DC converters. By sampling the isolated output voltage directly from the primary-side flyback waveform, the part requires no opto-isolator or third winding for regulation.
The LT8304 operates over a 3V to 100V input voltage range, has a 2A/150V integrated DMOS power switch and delivers up to 24 watts of output power, making it well suited for a wide variety of automotive and other applications.
Based in Brooklyn NY, Rear View Safety provides back up camera systems and video-based road safety solutions. Rear View Safety has been instrumental in driving the rapid adoption of video systems in commercial fleets including government fleets, recreational vehicles, truck, trailer, commercial van, construction, emergency, bus and shuttle, agriculture and industrial vehicles.
Qualcomm Incorporated (NASDAQ: QCOM) announced that its subsidiary, Qualcomm Technologies, Inc., is working with Google on an initiative bringing the power of Android OS embedded directly into the car.
The initiative aims to help car makers create powerful infotainment systems using Android as a common platform, making it easier to add connected services and applications while delivering a safer and more intuitive driving experience. The goal is to accelerate innovation in the car with an approach that offers openness, customization, and scale.